Yee Leng Low

Person

Chatham, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Optoelectronic circuit having one or more double-sided substrates
- Patent number 10,830,949
- Issue date Nov 10, 2020
- Nokia of America Corporation
- Yee L. Low
- G02 - OPTICS
Information Patent Grant
Optoelectronic circuit having one or more double-sided substrates
- Patent number 10,359,565
- Issue date Jul 23, 2019
- Nokia of America Corporation
- Yee L. Low
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement for connecting photonic and electronic components
- Patent number 10,338,329
- Issue date Jul 2, 2019
- Nokia Solutions and Networks Oy
- Yee Leng Low
- G02 - OPTICS
Information Patent Grant
Planar micro-miniature ion trap devices
- Patent number 7,217,922
- Issue date May 15, 2007
- Lucent Technologies Inc.
- Matthew Douglas Apau Jachowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging micromechanical devices
- Patent number 6,603,182
- Issue date Aug 5, 2003
- Lucent Technologies Inc.
- Yee Leng Low
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacture of printed circuit cards
- Patent number 6,370,766
- Issue date Apr 16, 2002
- Lucent Technologies Inc.
- Yinon Degani
- G01 - MEASURING TESTING
Information Patent Grant
Method of tuning a planar filter with additional coupling created b...
- Patent number 6,313,719
- Issue date Nov 6, 2001
- Avaya Technology Corp.
- Ron Barnett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with improved EMI characteristics
- Patent number 6,297,551
- Issue date Oct 2, 2001
- Agere Systems Guardian Corp.
- Thomas Dixon Dudderar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating high-Q RF components
- Patent number 6,232,047
- Issue date May 15, 2001
- Agere Systems Inc.
- Robert Charles Frye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed flip-chip package
- Patent number 6,154,370
- Issue date Nov 28, 2000
- Lucent Technologies Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-chip IC packages
- Patent number 5,898,223
- Issue date Apr 27, 1999
- Lucent Technologies Inc.
- Robert Charles Frye
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP-IN-CONNECTOR PHOTONIC APPARATUS
- Publication number 20190312653
- Publication date Oct 10, 2019
- Nokia Solutions and Networks Oy
- Yee Low
- G02 - OPTICS
Information Patent Application
OPTOELECTRONIC CIRCUIT HAVING ONE OR MORE DOUBLE-SIDED SUBSTRATES
- Publication number 20190302359
- Publication date Oct 3, 2019
- NOKIA OF AMERICA CORPORATION
- Yee L. Low
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMMUNICATION THROUGH WINDOW USING FREE-SPACE OPTICAL DATA COMMUNIC...
- Publication number 20190081706
- Publication date Mar 14, 2019
- Alcatel-Lucent USA Inc.
- David Neilson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ARRANGEMENT FOR CONNECTING PHOTONIC AND ELECTRONIC COMPONENTS
- Publication number 20190041591
- Publication date Feb 7, 2019
- Nokia Solutions and Networks Oy
- Yee Leng Low
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTOELECTRONIC CIRCUIT HAVING ONE OR MORE DOUBLE-SIDED SUBSTRATES
- Publication number 20180224601
- Publication date Aug 9, 2018
- Alcatel-Lucent USA Inc.
- Yee L. Low
- G02 - OPTICS
Information Patent Application
Planar micro-miniature ion trap devices
- Publication number 20060219888
- Publication date Oct 5, 2006
- Matthew Douglas Apau Jachowski
- H01 - BASIC ELECTRIC ELEMENTS

Yee Leng Low

Person

Patents Grantslast 30 patents

Optoelectronic circuit having one or more double-sided substrates

Optoelectronic circuit having one or more double-sided substrates

Arrangement for connecting photonic and electronic components

Planar micro-miniature ion trap devices

Packaging micromechanical devices

Manufacture of printed circuit cards

Method of tuning a planar filter with additional coupling created b...

Integrated circuit packages with improved EMI characteristics

Fabricating high-Q RF components

Recessed flip-chip package

Chip-on-chip IC packages

Patents Applicationslast 30 patents

CHIP-IN-CONNECTOR PHOTONIC APPARATUS

OPTOELECTRONIC CIRCUIT HAVING ONE OR MORE DOUBLE-SIDED SUBSTRATES

COMMUNICATION THROUGH WINDOW USING FREE-SPACE OPTICAL DATA COMMUNIC...

ARRANGEMENT FOR CONNECTING PHOTONIC AND ELECTRONIC COMPONENTS

OPTOELECTRONIC CIRCUIT HAVING ONE OR MORE DOUBLE-SIDED SUBSTRATES

Planar micro-miniature ion trap devices