Yee Mong Khoo

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Singapore, SG

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Patents Applicationslast 30 patents

Information Patent Application
Wafer Level Package and a Method of Forming the Same
- Publication number 20130001795
- Publication date Jan 3, 2013
- Agency For Science, Technology and Research
- Teck Guan LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Arrangement and a Method of Manufacturing a Substrate Arr...
- Publication number 20120126419
- Publication date May 24, 2012
- Vaidyanathan Kripesh
- H01 - BASIC ELECTRIC ELEMENTS