Yee Weon LIM

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Singapore, SG

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Patents Applicationslast 30 patents

Information Patent Application
BALL-BOND ARRANGEMENT
- Publication number 20250015037
- Publication date Jan 9, 2025
- Heraeus Materials Singapore Pte. Ltd.
- Yee Weon LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED WIRE
- Publication number 20240084472
- Publication date Mar 14, 2024
- Heraeus Materials Singapore Pte. Ltd.
- Murali SARANGAPANI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR