Membership
Tour
Register
Log in
Yeh-Chi HSU
Follow
Person
New Taipei City, TW
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Chip packaging method
Patent number
10,756,077
Issue date
Aug 25, 2020
SHANGHAI ZHAOXIN SEMICONDUCTOR CO., LTD.
Wen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package structure and chip package structure array
Patent number
10,504,847
Issue date
Dec 10, 2019
SHANGHAI ZHAOXIN SEMICONDUCTOR CO., LTD.
Wen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit substrate and semiconductor package structure
Patent number
10,204,852
Issue date
Feb 12, 2019
VIA ALLIANCE SEMICONDUCTOR CO., LTD.
Yeh-Chi Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit substrate and semiconductor package structure
Patent number
9,601,425
Issue date
Mar 21, 2017
VIA ALLIANCE SEMICONDUCTOR CO., LTD.
Yeh-Chi Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package structure
Patent number
9,418,964
Issue date
Aug 16, 2016
Via Technologies, Inc.
Wen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board and chip package structure
Patent number
8,796,848
Issue date
Aug 5, 2014
Via Technologies, Inc.
Wen-Yuan Chang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Pad structure, circuit carrier and integrated circuit chip
Patent number
8,736,079
Issue date
May 27, 2014
Via Technologies, Inc.
Yu-Kai Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and physical layer interface arrangement
Patent number
8,698,325
Issue date
Apr 15, 2014
Via Technologies, Inc.
Wen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabrication method of circuit board
Patent number
7,906,377
Issue date
Mar 15, 2011
VIA Technologies, Inc.
Wen-Yuan Chang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
PACKAGE SUBSTRATE, CHIP PACKAGE AND INTEGRATED CIRCUIT CHIP
Publication number
20220359364
Publication date
Nov 10, 2022
VIA TECHNOLOGIES, INC.
Wen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE AND CHIP PACKAGE STRUCTURE ARRAY
Publication number
20190139898
Publication date
May 9, 2019
Shanghai Zhaoxin Semiconductor Co., Ltd.
Wen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGING METHOD
Publication number
20190139952
Publication date
May 9, 2019
Shanghai Zhaoxin Semiconductor Co., Ltd.
Wen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT SUBSTRATE AND SEMICONDUCTOR PACKAGE STRUCTURE
Publication number
20170148720
Publication date
May 25, 2017
VIA Alliance Semiconductor Co., Ltd.
Yeh-Chi HSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT SUBSTRATE AND SEMICONDUCTOR PACKAGE STRUCTURE
Publication number
20160126175
Publication date
May 5, 2016
VIA Alliance Semiconductor Co., Ltd.
Yeh-Chi HSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE
Publication number
20130175681
Publication date
Jul 11, 2013
VIA TECHNOLOGIES, INC.
Wen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PAD STRUCTURE, CIRCUIT CARRIER AND INTEGRATED CIRCUIT CHIP
Publication number
20120299192
Publication date
Nov 29, 2012
VIA TECHNOLOGIES, INC.
Yu-Kai Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND PHYSICAL LAYER INTERFACE ARRANGEMENT
Publication number
20120098125
Publication date
Apr 26, 2012
VIA TECHNOLOGIES, INC.
Wen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT BOARD AND CHIP PACKAGE STRUCTURE
Publication number
20110108984
Publication date
May 12, 2011
VIA TECHNOLOGIES, INC.
Wen-Yuan Chang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD AND FABRICATION METHOD THEREOF AND CHIP PACKAGE STRUC...
Publication number
20100155939
Publication date
Jun 24, 2010
VIA TECHNOLOGIES, INC.
Wen-Yuan Chang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR