Yeh Sung

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Chung Li, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for reducing stress in nickel-based alloy plating
- Patent number 6,699,379
- Issue date Mar 2, 2004
- Industrial Technology Research Institute
- Shih-Tsung Ke
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR