Yen-Ming Chu

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and manufacturing method of the same
- Patent number 12,119,261
- Issue date Oct 15, 2024
- Winbond Electronics Corp.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for bicycle fitting
- Patent number 11,878,214
- Issue date Jan 23, 2024
- Giant Manufacturing Co., Ltd.
- Ya-Han Chang
- A63 - SPORTS GAMES AMUSEMENTS
Information Patent Grant
Semiconductor device including uneven contact in passivation layer
- Patent number 11,658,138
- Issue date May 23, 2023
- Winbond Electronics Corp.
- Yen-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing circuit structure
- Patent number 11,610,857
- Issue date Mar 21, 2023
- Winbond Electronics Corp.
- Jin-Neng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,322,438
- Issue date May 3, 2022
- Winbond Electronics Corp.
- Yen-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including uneven contact in passivation layer...
- Patent number 11,309,267
- Issue date Apr 19, 2022
- Winbond Electronics Corp.
- Yen-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,145,596
- Issue date Oct 12, 2021
- Winbond Electronics Corp.
- Yen-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer (RDL) structure and method of manufacturing th...
- Patent number 11,063,010
- Issue date Jul 13, 2021
- Winbond Electronics Corp.
- Yen-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensing device, nursing bra, and manufacturing method thereof
- Patent number 10,842,421
- Issue date Nov 24, 2020
- Winbond Electronics Corp.
- Ming-Hung Hsieh
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Patterned structure for electronic device and manufacturing method...
- Patent number 10,818,497
- Issue date Oct 27, 2020
- Winbond Electronics Corp.
- Yen-Jui Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reduction-oxidation sensor device and manufacturing method thereof
- Patent number 10,697,919
- Issue date Jun 30, 2020
- Winbond Electronics Corp.
- Ming-Chih Tsai
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Semiconductor device including conductive structure
- Patent number 10,658,320
- Issue date May 19, 2020
- Winbond Electronics Corp.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas detecting device
- Patent number 10,282,964
- Issue date May 7, 2019
- Winbond Electronics Corp.
- Ming-Hung Hsieh
- G01 - MEASURING TESTING
Information Patent Grant
Bone conduction hearing aid device and bone conduction speaker
- Patent number 10,277,995
- Issue date Apr 30, 2019
- Winbond Electronics Corp.
- Ming-Hung Hsieh
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Cable of easy collection
- Patent number 7,507,908
- Issue date Mar 24, 2009
- Merry Electronics Co., Ltd.
- Hsin-hsien Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240234335
- Publication date Jul 11, 2024
- Siliconware Precision Industries Co., Ltd.
- Yen-Yu CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230317520
- Publication date Oct 5, 2023
- WINBOND ELECTRONICS CORP.
- Chun-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING UNEVEN CONTACT IN PASSIVATION LAYER
- Publication number 20220181282
- Publication date Jun 9, 2022
- WINBOND ELECTRONICS CORP.
- Yen-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220077051
- Publication date Mar 10, 2022
- WINBOND ELECTRONICS CORP.
- Yen-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING UNEVEN CONTACT IN PASSIVATION LAYER...
- Publication number 20220020711
- Publication date Jan 20, 2022
- WINBOND ELECTRONICS CORP.
- Yen-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT STRUCTURE
- Publication number 20210407946
- Publication date Dec 30, 2021
- WINBOND ELECTRONICS CORP.
- Jin-Neng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR BICYCLE FITTING
- Publication number 20210308523
- Publication date Oct 7, 2021
- GIANT MANUFACTURING CO., LTD.
- Ya-Han CHANG
- A63 - SPORTS GAMES AMUSEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20210183764
- Publication date Jun 17, 2021
- WINBOND ELECTRONICS CORP.
- Yen-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200350268
- Publication date Nov 5, 2020
- WINBOND ELECTRONICS CORP.
- Yen-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER (RDL) STRUCTURE AND METHOD OF MANUFACTURING TH...
- Publication number 20200251434
- Publication date Aug 6, 2020
- WINBOND ELECTRONICS CORP.
- Yen-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200251435
- Publication date Aug 6, 2020
- WINBOND ELECTRONICS CORP.
- Jin-Neng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200161264
- Publication date May 21, 2020
- WINBOND ELECTRONICS CORP.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONE CONDUCTION HEARING AID DEVICE AND BONE CONDUCTION SPEAKER
- Publication number 20180234779
- Publication date Aug 16, 2018
- WINBOND ELECTRONICS CORP.
- Ming-Hung Hsieh
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
REDUCTION-OXIDATION SENSOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180209927
- Publication date Jul 26, 2018
- WINBOND ELECTRONICS CORP.
- Ming-Chih Tsai
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
GAS DETECTING DEVICE
- Publication number 20180202956
- Publication date Jul 19, 2018
- WINBOND ELECTRONICS CORP.
- Ming-Hung Hsieh
- G08 - SIGNALLING
Information Patent Application
SENSING DEVICE, NURSING BRA, AND MANUFACTURING METHOD THEREOF
- Publication number 20180160952
- Publication date Jun 14, 2018
- WINBOND ELECTRONICS CORP.
- Ming-Hung Hsieh
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
PATTERNED STRUCTURE FOR ELECTRONIC DEVICE AND MANUFACTURING METHOD...
- Publication number 20180151374
- Publication date May 31, 2018
- WINBOND ELECTRONICS CORP.
- Yen-Jui Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MOBILE SELLING SYSTEM AND A METHOD THEREOF
- Publication number 20100019025
- Publication date Jan 28, 2010
- Fa-Yu Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ADVERTISEMENT BROADCASTING SYSTEM WITH LOCATION-IDENTIFYING ABILITY
- Publication number 20100023967
- Publication date Jan 28, 2010
- Fa-Yu Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Headset and Method for Collecting same
- Publication number 20090316942
- Publication date Dec 24, 2009
- Chung-Yi Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Yen-Ming Chu

Person

Patents Grantslast 30 patents

Semiconductor structure and manufacturing method of the same

Methods and systems for bicycle fitting

Semiconductor device including uneven contact in passivation layer

Method of manufacturing circuit structure

Package structure and manufacturing method thereof

Semiconductor device including uneven contact in passivation layer...

Package structure and method of forming the same

Redistribution layer (RDL) structure and method of manufacturing th...

Sensing device, nursing bra, and manufacturing method thereof

Patterned structure for electronic device and manufacturing method...

Reduction-oxidation sensor device and manufacturing method thereof

Semiconductor device including conductive structure

Gas detecting device

Bone conduction hearing aid device and bone conduction speaker

Cable of easy collection

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE INCLUDING UNEVEN CONTACT IN PASSIVATION LAYER

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE INCLUDING UNEVEN CONTACT IN PASSIVATION LAYER...

METHOD OF MANUFACTURING CIRCUIT STRUCTURE

METHODS AND SYSTEMS FOR BICYCLE FITTING

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

WIRE BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SAME

REDISTRIBUTION LAYER (RDL) STRUCTURE AND METHOD OF MANUFACTURING TH...

CIRCUIT STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

BONE CONDUCTION HEARING AID DEVICE AND BONE CONDUCTION SPEAKER

REDUCTION-OXIDATION SENSOR DEVICE AND MANUFACTURING METHOD THEREOF

GAS DETECTING DEVICE

SENSING DEVICE, NURSING BRA, AND MANUFACTURING METHOD THEREOF

PATTERNED STRUCTURE FOR ELECTRONIC DEVICE AND MANUFACTURING METHOD...

MOBILE SELLING SYSTEM AND A METHOD THEREOF

ADVERTISEMENT BROADCASTING SYSTEM WITH LOCATION-IDENTIFYING ABILITY

Headset and Method for Collecting same