Yen-Po Huang

Person

Hsinchu Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Flexible substrate assembly and its application for fabricating fle...
- Patent number 10,334,738
- Issue date Jun 25, 2019
- Taimide Technology Incorporation
- Yen-Po Huang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Flexible substrate assembly and its application for fabricating fle...
- Patent number 10,212,821
- Issue date Feb 19, 2019
- Taimide Technology Incorporation
- Yen-Po Huang
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Fabrication of a flexible circuit board
- Patent number 9,839,136
- Issue date Dec 5, 2017
- Taimide Technology Incorporation
- Paul S. C. Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked package structure of image sensor
- Patent number 6,627,983
- Issue date Sep 30, 2003
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked package structure of image sensor
- Patent number 6,559,539
- Issue date May 6, 2003
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure for an integrated circuit package and method fo...
- Patent number 6,489,572
- Issue date Dec 3, 2002
- Kingpak Technology Inc.
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE SUBSTRATE ASSEMBLY AND ITS APPLICATION FOR FABRICATING FLE...
- Publication number 20180042116
- Publication date Feb 8, 2018
- TAIMIDE TECHNOLOGY INCORPORATION
- Yen-Po Huang
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
FLEXIBLE SUBSTRATE ASSEMBLY AND ITS APPLICATION FOR FABRICATING FLE...
- Publication number 20180042125
- Publication date Feb 8, 2018
- TAIMIDE TECHNOLOGY INCORPORATION
- Yen-Po Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED POLYIMIDE FILM CONTAINING SILOXANE, AND ITS FABRICATIO...
- Publication number 20170298249
- Publication date Oct 19, 2017
- TAIMIDE TECHNOLOGY INCORPORATION
- Chih-Wei Lin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ULTRA-THIN POLYIMIDE FILM, AND MANUFACTURE AND ASSEMBLY THEREOF
- Publication number 20170107400
- Publication date Apr 20, 2017
- TAIMIDE TECHNOLOGY INCORPORATION
- Yen-Po Huang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FABRICATION OF A FLEXIBLE CIRCUIT BOARD
- Publication number 20170064838
- Publication date Mar 2, 2017
- TAIMIDE TECHNOLOGY INCORPORATION
- Paul S.C. Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYIMIDE FILM ARRANGEMENT, AND MANUFACTURE AND ASSEMBLY THEREOF
- Publication number 20160060404
- Publication date Mar 3, 2016
- TAIMIDE TECHNOLOGY INCORPORATION
- Chih-Wei Lin
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SUBSTRATE STRUCTURE FOR AN INTEGRATED CIRCUIT PACKAGE AND METHOD FO...
- Publication number 20020096360
- Publication date Jul 25, 2002
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked structure of integrated circuits
- Publication number 20020096754
- Publication date Jul 25, 2002
- Wen Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure of stacked integrated circuits and method for manufacturi...
- Publication number 20020096762
- Publication date Jul 25, 2002
- Wen Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure of integrated circuits and method for packaging t...
- Publication number 20020096766
- Publication date Jul 25, 2002
- Wen Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked package structure of image sensor
- Publication number 20020096729
- Publication date Jul 25, 2002
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked package structure of image sensor
- Publication number 20020096730
- Publication date Jul 25, 2002
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF STACKED INTEGRATED CIRCUITS AND METHOD FOR MANUFACTURI...
- Publication number 20020096761
- Publication date Jul 25, 2002
- Wen Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked package structure of image sensor
- Publication number 20020096753
- Publication date Jul 25, 2002
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS

Yen-Po Huang

Person

Patents Grantslast 30 patents

Flexible substrate assembly and its application for fabricating fle...

Flexible substrate assembly and its application for fabricating fle...

Fabrication of a flexible circuit board

Stacked package structure of image sensor

Stacked package structure of image sensor

Substrate structure for an integrated circuit package and method fo...

Patents Applicationslast 30 patents

FLEXIBLE SUBSTRATE ASSEMBLY AND ITS APPLICATION FOR FABRICATING FLE...

FLEXIBLE SUBSTRATE ASSEMBLY AND ITS APPLICATION FOR FABRICATING FLE...

MULTILAYERED POLYIMIDE FILM CONTAINING SILOXANE, AND ITS FABRICATIO...

ULTRA-THIN POLYIMIDE FILM, AND MANUFACTURE AND ASSEMBLY THEREOF

FABRICATION OF A FLEXIBLE CIRCUIT BOARD

POLYIMIDE FILM ARRANGEMENT, AND MANUFACTURE AND ASSEMBLY THEREOF

SUBSTRATE STRUCTURE FOR AN INTEGRATED CIRCUIT PACKAGE AND METHOD FO...

Stacked structure of integrated circuits

Structure of stacked integrated circuits and method for manufacturi...

Package structure of integrated circuits and method for packaging t...

Stacked package structure of image sensor

Stacked package structure of image sensor

STRUCTURE OF STACKED INTEGRATED CIRCUITS AND METHOD FOR MANUFACTURI...

Stacked package structure of image sensor