Yen-Shan Chuang

Person

HsinChu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Fill structures with air gaps
- Patent number 12,324,199
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Yung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flash memory device and method thereof
- Patent number 12,051,756
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yun Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fill structures with air gaps
- Patent number 11,961,884
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Yung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,411,108
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,818,790
- Issue date Oct 27, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,319,857
- Issue date Jun 11, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,812,570
- Issue date Nov 7, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement with stress control and method of making
- Patent number 9,721,827
- Issue date Aug 1, 2017
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Fan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dopant implantation method using multi-step implants
- Patent number 8,008,158
- Issue date Aug 30, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tse-En Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of predicting CMP removal rate for CMP process in a CMP proc...
- Patent number 7,333,875
- Issue date Feb 19, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen Chuang
- B24 - GRINDING POLISHING
Information Patent Grant
Method for CMP removal rate compensation
- Patent number 7,071,106
- Issue date Jul 4, 2006
- Taiwan Semiconductor Manufacturing Company
- Yen Chuang
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
STACKED TRANSISTOR ISOLATION FEATURES AND METHODS OF FORMING THE SAME
- Publication number 20250048689
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ji-Yin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH STOP LAYER FOR REMOVAL OF SUBSTRATE IN STACKING TRANSISTORS AN...
- Publication number 20250048716
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TRANSISTOR ISOLATION FEATURES AND METHODS OF FORMING THE SAME
- Publication number 20250031435
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS COMMUNICATION METHOD AND DEVICE
- Publication number 20240397576
- Publication date Nov 28, 2024
- MEDIATEK INC.
- Hao-Hua KANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FLASH MEMORY DEVICE AND METHOD THEREOF
- Publication number 20240339547
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yun LI
- G11 - INFORMATION STORAGE
Information Patent Application
Fill Structures With Air Gaps
- Publication number 20240250121
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Yung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-FUNCTION ETCHING SACRIFICIAL LAYERS TO PROTECT THREE-DIMENSIO...
- Publication number 20240162079
- Publication date May 16, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Miao-Syuan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLASH MEMORY DEVICE AND METHOD THEREOF
- Publication number 20230020015
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yun LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILL STRUCTURES WITH AIR GAPS
- Publication number 20220320273
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiu-Yung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210043771
- Publication date Feb 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Fen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20190312144
- Publication date Oct 10, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Fen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180069120
- Publication date Mar 8, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Fen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20170005196
- Publication date Jan 5, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Fen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT WITH STRESS CONTROL AND METHOD OF MAKING
- Publication number 20150243785
- Publication date Aug 27, 2015
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Fan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPANT IMPLANTATION METHOD AND INTEGRATED CIRCUITS FORMED THEREBY
- Publication number 20100009506
- Publication date Jan 14, 2010
- Taiwan Semiconductor Manufacturing Co., LTD
- Tse-En Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrode structure
- Publication number 20060220521
- Publication date Oct 5, 2006
- DELTA OPTOELECTRONICS, INC.
- Jer-Shien Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of predicting CMP removal rate for CMP process in a CMP proc...
- Publication number 20060116785
- Publication date Jun 1, 2006
- Yen Chuang
- B24 - GRINDING POLISHING
Information Patent Application
Method for CMP removal rate compensation
- Publication number 20050124165
- Publication date Jun 9, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen Chuang
- B24 - GRINDING POLISHING

Yen-Shan Chuang

Person

Patents Grantslast 30 patents

Fill structures with air gaps

Flash memory device and method thereof

Fill structures with air gaps

Semiconductor device and manufacturing method thereof

Semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor arrangement with stress control and method of making

Dopant implantation method using multi-step implants

Method of predicting CMP removal rate for CMP process in a CMP proc...

Method for CMP removal rate compensation

Patents Applicationslast 30 patents

STACKED TRANSISTOR ISOLATION FEATURES AND METHODS OF FORMING THE SAME

ETCH STOP LAYER FOR REMOVAL OF SUBSTRATE IN STACKING TRANSISTORS AN...

STACKED TRANSISTOR ISOLATION FEATURES AND METHODS OF FORMING THE SAME

WIRELESS COMMUNICATION METHOD AND DEVICE

FLASH MEMORY DEVICE AND METHOD THEREOF

Fill Structures With Air Gaps

MULTI-FUNCTION ETCHING SACRIFICIAL LAYERS TO PROTECT THREE-DIMENSIO...

FLASH MEMORY DEVICE AND METHOD THEREOF

FILL STRUCTURES WITH AIR GAPS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR ARRANGEMENT WITH STRESS CONTROL AND METHOD OF MAKING

DOPANT IMPLANTATION METHOD AND INTEGRATED CIRCUITS FORMED THEREBY

Electrode structure

Method of predicting CMP removal rate for CMP process in a CMP proc...

Method for CMP removal rate compensation