Yen-Shih Ho

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of chip package
- Patent number 11,476,293
- Issue date Oct 18, 2022
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,038,077
- Issue date Jun 15, 2021
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing semiconductor...
- Patent number 10,461,117
- Issue date Oct 29, 2019
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 10,424,540
- Issue date Sep 24, 2019
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer coating system and method of manufacturing chip package
- Patent number 10,388,541
- Issue date Aug 20, 2019
- Xintec Inc.
- Yu-Tung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Touch panel-sensing chip package module complex and a manufacturing...
- Patent number 10,318,784
- Issue date Jun 11, 2019
- Xintec Inc.
- Shu-Ming Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package and method for forming the same
- Patent number 10,153,237
- Issue date Dec 11, 2018
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale sensing chip package and a manufacturing method thereof
- Patent number 10,152,180
- Issue date Dec 11, 2018
- Xintec Inc.
- Shu-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and fabrication method thereof
- Patent number 10,109,559
- Issue date Oct 23, 2018
- Xintec Inc.
- Chia-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,096,635
- Issue date Oct 9, 2018
- Xintec Inc.
- Wei-Ming Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and fabrication method thereof
- Patent number 10,049,252
- Issue date Aug 14, 2018
- Xintec Inc.
- Yen-Shih Ho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package and method for forming the same
- Patent number 10,050,006
- Issue date Aug 14, 2018
- Xintec Inc.
- Chia-Lun Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,997,473
- Issue date Jun 12, 2018
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive module and method for forming the same
- Patent number 9,978,788
- Issue date May 22, 2018
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,947,716
- Issue date Apr 17, 2018
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensing chip package and a manufacturing method thereof
- Patent number 9,887,229
- Issue date Feb 6, 2018
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for fabricating the same
- Patent number 9,881,889
- Issue date Jan 30, 2018
- Xintec Inc.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,875,912
- Issue date Jan 23, 2018
- Xintec Inc.
- Yen-Shih Ho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,793,234
- Issue date Oct 17, 2017
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 9,780,251
- Issue date Oct 3, 2017
- Xintec Inc.
- Wei-Luen Suen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive component structure and manufacturing method thereof
- Patent number 9,761,555
- Issue date Sep 12, 2017
- Xintec Inc.
- Jiun-Yen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package
- Patent number 9,711,403
- Issue date Jul 18, 2017
- Xintec Inc.
- Chien-Hui Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separation apparatus and a method for separating a cap layer from a...
- Patent number 9,685,354
- Issue date Jun 20, 2017
- Xintec Inc.
- Yen-Shih Ho
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,653,422
- Issue date May 16, 2017
- Xintec Inc.
- Chia-Lun Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical contact structure with a redistribution layer connected...
- Patent number 9,640,683
- Issue date May 2, 2017
- Xintec Inc.
- Wei-Luen Suen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,640,488
- Issue date May 2, 2017
- Xintec Inc.
- Yi-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chip package including substrate with recess adjoining side...
- Patent number 9,633,935
- Issue date Apr 25, 2017
- Xintec Inc.
- Yen-Shih Ho
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 9,613,904
- Issue date Apr 4, 2017
- Xintec Inc.
- Yu-Tung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package
- Patent number 9,611,143
- Issue date Apr 4, 2017
- Xintec Inc.
- Yen-Shih Ho
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package including recess in side edge
- Patent number 9,601,460
- Issue date Mar 21, 2017
- XINTEC INC.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF CHIP PACKAGE
- Publication number 20210066379
- Publication date Mar 4, 2021
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20190273175
- Publication date Sep 5, 2019
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180358398
- Publication date Dec 13, 2018
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20180175101
- Publication date Jun 21, 2018
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20180102321
- Publication date Apr 12, 2018
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20170271276
- Publication date Sep 21, 2017
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20170213805
- Publication date Jul 27, 2017
- XINTEC INC.
- Chia-Lun SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20170207182
- Publication date Jul 20, 2017
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170179330
- Publication date Jun 22, 2017
- XINTEC INC.
- Wei-Luen SUEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170148844
- Publication date May 25, 2017
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170148752
- Publication date May 25, 2017
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170148694
- Publication date May 25, 2017
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20170117242
- Publication date Apr 27, 2017
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170110495
- Publication date Apr 20, 2017
- XINTEC INC.
- Jyun-Liang WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSING CHIP PACKAGE AND A MANUFACTURING METHOD THEREOF
- Publication number 20170040372
- Publication date Feb 9, 2017
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170012081
- Publication date Jan 12, 2017
- XINTEC INC.
- Chia-Lun SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOUCH PANEL-SENSING CHIP PACKAGE MODULE COMPLEX AND A MANUFACTURING...
- Publication number 20160379040
- Publication date Dec 29, 2016
- XINTEC INC.
- Shu-Ming CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20160329283
- Publication date Nov 10, 2016
- XINTEC INC.
- Yu-Tung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELECTROPLATING SYSTEM
- Publication number 20160315048
- Publication date Oct 27, 2016
- XINTEC INC.
- Yen-Shih HO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20160315061
- Publication date Oct 27, 2016
- XINTEC INC.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20160315043
- Publication date Oct 27, 2016
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER COATING SYSTEM AND METHOD OF MANUFACTURING CHIP PACKAGE
- Publication number 20160307779
- Publication date Oct 20, 2016
- XINTEC INC.
- Yu-Tung CHEN
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
CHIP SCALE SENSING CHIP PACKAGE AND A MANUFACTURING METHOD THEREOF
- Publication number 20160284751
- Publication date Sep 29, 2016
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE SENSING CHIP PACKAGE AND A MANUFACTURING METHOD THEREOF
- Publication number 20160266680
- Publication date Sep 15, 2016
- XINTEC INC.
- Shu-Ming CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20160240520
- Publication date Aug 18, 2016
- XINTEC INC.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE SENSING CHIP PACKAGE AND A MANUFACTURING METHOD THEREOF
- Publication number 20160239699
- Publication date Aug 18, 2016
- XINTEC INC.
- Shu-Ming CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20160218140
- Publication date Jul 28, 2016
- XINTEC INC.
- Wei-Ming CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE MODULE AND METHOD FOR FORMING THE SAME
- Publication number 20160218133
- Publication date Jul 28, 2016
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20160171273
- Publication date Jun 16, 2016
- XINTEC INC.
- Yen-Shih HO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20160141254
- Publication date May 19, 2016
- XINTEC INC.
- Yi-Min LIN
- H01 - BASIC ELECTRIC ELEMENTS

Yen-Shih Ho

Person

Patents Grantslast 30 patents

Manufacturing method of chip package

Chip package and manufacturing method thereof

Semiconductor structure and method for manufacturing semiconductor...

Chip package and method for forming the same

Wafer coating system and method of manufacturing chip package

Touch panel-sensing chip package module complex and a manufacturing...

Chip package and method for forming the same

Chip scale sensing chip package and a manufacturing method thereof

Electronic device package and fabrication method thereof

Semiconductor structure and manufacturing method thereof

Chip package and fabrication method thereof

Chip package and method for forming the same

Chip package and method for forming the same

Photosensitive module and method for forming the same

Chip package and manufacturing method thereof

Sensing chip package and a manufacturing method thereof

Chip package and method for fabricating the same

Chip package and manufacturing method thereof

Chip package and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Passive component structure and manufacturing method thereof

Method for forming chip package

Separation apparatus and a method for separating a cap layer from a...

Chip package and method for forming the same

Electrical contact structure with a redistribution layer connected...

Chip package and method for forming the same

Stacked chip package including substrate with recess adjoining side...

Semiconductor structure and manufacturing method thereof

Method for forming chip package

Chip package including recess in side edge

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF CHIP PACKAGE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

SENSING CHIP PACKAGE AND A MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

TOUCH PANEL-SENSING CHIP PACKAGE MODULE COMPLEX AND A MANUFACTURING...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR ELECTROPLATING SYSTEM

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

WAFER COATING SYSTEM AND METHOD OF MANUFACTURING CHIP PACKAGE

CHIP SCALE SENSING CHIP PACKAGE AND A MANUFACTURING METHOD THEREOF

CHIP SCALE SENSING CHIP PACKAGE AND A MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP SCALE SENSING CHIP PACKAGE AND A MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

PHOTOSENSITIVE MODULE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND FABRICATION METHOD THEREOF

CHIP PACKAGE AND METHOD FOR FORMING THE SAME