Yeo-Il PARK

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Suwon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Electronic component embedded substrate
- Patent number 11,640,952
- Issue date May 2, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Mi Sun Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate embedded electronic component package
- Patent number 11,631,643
- Issue date Apr 18, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Dae Jung Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate having electronic component embedded therein
- Patent number 11,183,462
- Issue date Nov 23, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Mi Sun Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board having embedded electronic device
- Patent number 10,779,396
- Issue date Sep 15, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yeo-Il Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT EMBEDDED SUBSTRATE
- Publication number 20210193609
- Publication date Jun 24, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Mi Sun HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE EMBEDDED ELECTRONIC COMPONENT PACKAGE
- Publication number 20210183774
- Publication date Jun 17, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Dae Jung BYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN
- Publication number 20210183784
- Publication date Jun 17, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Mi Sun HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC DEVICE
- Publication number 20200178385
- Publication date Jun 4, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Yeo-Il PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR