Yeong-Jyh Lin

Person

Caotun Township, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Embedded backside memory on a field effect transistor
- Patent number 11,925,033
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Liang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photolithography alignment process for bonded wafers
- Patent number 11,916,022
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D trench capacitor for integrated passive devices
- Patent number 11,862,612
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition system for high accuracy patterning
- Patent number 11,818,944
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ping-Yin Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Mechanical wafer alignment detection for bonding process
- Patent number 11,688,717
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Hung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level transfer molding and apparatus for performing the same
- Patent number 11,390,000
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Ping Jang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Photolithography alignment process for bonded wafers
- Patent number 11,362,038
- Issue date Jun 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for wafer bonding
- Patent number 11,348,790
- Issue date May 31, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming bonding structures
- Patent number 11,233,032
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D trench capacitor for integrated passive devices
- Patent number 11,211,362
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for alignment, process tool and method for wafer-level align...
- Patent number 11,189,515
- Issue date Nov 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Hung Wang
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor structure and associated manufacturing method
- Patent number 11,127,725
- Issue date Sep 21, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level underfill and over-molding
- Patent number 11,024,618
- Issue date Jun 1, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Ping Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for controlling warpage in packaging
- Patent number 10,985,135
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a boundary structure, a package on pack...
- Patent number 10,804,234
- Issue date Oct 13, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer device and manufacturing method thereof
- Patent number 10,770,331
- Issue date Sep 8, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Bor-Ping Jang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging through pre-formed metal pins
- Patent number 10,734,345
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for alignment, process tool and method for wafer-level align...
- Patent number 10,636,688
- Issue date Apr 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Hung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for wafer bonding
- Patent number 10,636,661
- Issue date Apr 28, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked LED structure and associated manufacturing method
- Patent number 10,622,342
- Issue date Apr 14, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level transfer molding and apparatus for performing the same
- Patent number 10,513,070
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Ping Jang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Methods for controlling warpage in packaging
- Patent number 10,510,712
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming bonding structures
- Patent number 10,504,870
- Issue date Dec 10, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a boundary structure, a package on pack...
- Patent number 10,276,531
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for controlling warpage in packaging
- Patent number 10,157,881
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for stud bump formation
- Patent number 10,147,693
- Issue date Dec 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer device and manufacturing method thereof
- Patent number 10,056,285
- Issue date Aug 21, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Bor-Ping Jang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging through pre-formed metal pins
- Patent number 9,929,118
- Issue date Mar 27, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding system and cleaning method thereof
- Patent number 9,917,069
- Issue date Mar 13, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level underfill and over-molding
- Patent number 9,893,044
- Issue date Feb 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Ping Jang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS
- Publication number 20240186258
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yeong-Jyh Lin
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
3D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES
- Publication number 20240088103
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BACKSIDE MEMORY ON A FIELD EFFECT TRANSISTOR
- Publication number 20230389335
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Liang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR BONDING TOOL AND METHOD OF OPERATING THE SAME
- Publication number 20230378125
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION SYSTEM FOR HIGH ACCURACY PATTERNING
- Publication number 20230371354
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MECHANICAL WAFER ALIGNMENT DETECTION FOR BONDING PROCESS
- Publication number 20230282612
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Hung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICAL WAFER ALIGNMENT DETECTION FOR BONDING PROCESS
- Publication number 20230066893
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Hung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS
- Publication number 20220328419
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yeong-Jyh Lin
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
EMBEDDED BACKSIDE MEMORY ON A FIELD EFFECT TRANSISTOR
- Publication number 20220320180
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuan-Liang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR WAFER BONDING
- Publication number 20220285156
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- YEONG-JYH LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES
- Publication number 20220115358
- Publication date Apr 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS
- Publication number 20210375781
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES
- Publication number 20210296283
- Publication date Sep 23, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION SYSTEM FOR HIGH ACCURACY PATTERNING
- Publication number 20210273167
- Publication date Sep 2, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR WAFER BONDING
- Publication number 20200258743
- Publication date Aug 13, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- YEONG-JYH LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ALIGNMENT, PROCESS TOOL AND METHOD FOR WAFER-LEVEL ALIGN...
- Publication number 20200227298
- Publication date Jul 16, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Ching-Hung Wang
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR STRUCTURE AND ASSOCIATED MANUFACTURING METHOD
- Publication number 20200185369
- Publication date Jun 11, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- PING-YIN LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Controlling Warpage in Packaging
- Publication number 20200118969
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Transfer Molding and Apparatus for Performing the Same
- Publication number 20200114556
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Ping Jang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Mechanisms for Forming Bonding Structures
- Publication number 20200105710
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND ALIGNMENT METHOD FOR HIGH ACCURACY AND HIGH THROUGHPUT
- Publication number 20190393067
- Publication date Dec 26, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Ching-Hung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A BOUNDARY STRUCTURE, A PACKAGE ON PACK...
- Publication number 20190237422
- Publication date Aug 1, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND ASSOCIATED MANUFACTURING METHOD
- Publication number 20190139949
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- PING-YIN LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Controlling Warpage in Packaging
- Publication number 20190123018
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180358255
- Publication date Dec 13, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- BOR-PING JANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaging through Pre-Formed Metal Pins
- Publication number 20180204816
- Publication date Jul 19, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-Level Underfill and Over-Molding
- Publication number 20180175013
- Publication date Jun 21, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Ping Jang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR WAFER DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180047611
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- BOR-PING JANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer Level Transfer Molding and Apparatus for Performing the Same
- Publication number 20180043593
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Ping Jang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Mechanisms For Forming Bonding Structures
- Publication number 20180005976
- Publication date Jan 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS

Yeong-Jyh Lin

Person

Patents Grantslast 30 patents

Embedded backside memory on a field effect transistor

Photolithography alignment process for bonded wafers

3D trench capacitor for integrated passive devices

Deposition system for high accuracy patterning

Mechanical wafer alignment detection for bonding process

Wafer level transfer molding and apparatus for performing the same

Photolithography alignment process for bonded wafers

Apparatus and method for wafer bonding

Mechanisms for forming bonding structures

3D trench capacitor for integrated passive devices

Method for alignment, process tool and method for wafer-level align...

Semiconductor structure and associated manufacturing method

Wafer-level underfill and over-molding

Methods for controlling warpage in packaging

Semiconductor device having a boundary structure, a package on pack...

Semiconductor wafer device and manufacturing method thereof

Packaging through pre-formed metal pins

Method for alignment, process tool and method for wafer-level align...

Apparatus and method for wafer bonding

Stacked LED structure and associated manufacturing method

Wafer level transfer molding and apparatus for performing the same

Methods for controlling warpage in packaging

Mechanisms for forming bonding structures

Semiconductor device having a boundary structure, a package on pack...

Methods for controlling warpage in packaging

Methods for stud bump formation

Semiconductor wafer device and manufacturing method thereof

Packaging through pre-formed metal pins

Hybrid bonding system and cleaning method thereof

Wafer-level underfill and over-molding

Patents Applicationslast 30 patents

PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS

3D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES

EMBEDDED BACKSIDE MEMORY ON A FIELD EFFECT TRANSISTOR

SEMICONDUCTOR BONDING TOOL AND METHOD OF OPERATING THE SAME

DEPOSITION SYSTEM FOR HIGH ACCURACY PATTERNING

MECHANICAL WAFER ALIGNMENT DETECTION FOR BONDING PROCESS

MECHANICAL WAFER ALIGNMENT DETECTION FOR BONDING PROCESS

PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS

EMBEDDED BACKSIDE MEMORY ON A FIELD EFFECT TRANSISTOR

APPARATUS AND METHOD FOR WAFER BONDING

3D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES

PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS

3D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES

DEPOSITION SYSTEM FOR HIGH ACCURACY PATTERNING

APPARATUS AND METHOD FOR WAFER BONDING

METHOD FOR ALIGNMENT, PROCESS TOOL AND METHOD FOR WAFER-LEVEL ALIGN...

SEMICONDUCTOR STRUCTURE AND ASSOCIATED MANUFACTURING METHOD

Methods for Controlling Warpage in Packaging

Wafer Level Transfer Molding and Apparatus for Performing the Same

Mechanisms for Forming Bonding Structures

BOND ALIGNMENT METHOD FOR HIGH ACCURACY AND HIGH THROUGHPUT

SEMICONDUCTOR DEVICE HAVING A BOUNDARY STRUCTURE, A PACKAGE ON PACK...

SEMICONDUCTOR STRUCTURE AND ASSOCIATED MANUFACTURING METHOD

Methods for Controlling Warpage in Packaging

SEMICONDUCTOR WAFER DEVICE AND MANUFACTURING METHOD THEREOF

Packaging through Pre-Formed Metal Pins

Wafer-Level Underfill and Over-Molding

SEMICONDUCTOR WAFER DEVICE AND MANUFACTURING METHOD THEREOF

Wafer Level Transfer Molding and Apparatus for Performing the Same

Mechanisms For Forming Bonding Structures