Yeong-Jyh Lin

Person

Tainan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Control system and control method
- Patent number 10,764,117
- Issue date Sep 1, 2020
- Atop Technologies Inc.
- Yeong-Shuenn Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Zigzag-stacked package structure
- Patent number 7,781,878
- Issue date Aug 24, 2010
- ChipMOS Technologies Inc.
- Yu-Ren Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
COB type IC package to enhanced bondibility of bumps embedded in su...
- Patent number 7,642,639
- Issue date Jan 5, 2010
- ChipMOS Technologies Inc.
- Hsiang-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency IC package and method for fabricating the same
- Patent number 7,554,197
- Issue date Jun 30, 2009
- Chipmos Technologies (Bermuda) Ltd.
- Hsiang-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimal contention region allocation for medium access control in m...
- Patent number 6,754,225
- Issue date Jun 22, 2004
- National Science Council
- Ying-Dar Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
Zigzag-stacked package structure
- Publication number 20080174000
- Publication date Jul 24, 2008
- Yu-Ren CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication processes of a MEMS alloy probe
- Publication number 20080124828
- Publication date May 29, 2008
- ChipMOS Technologies (Bermuda) Ltd.
- Hsiang-Ming Huang
- G01 - MEASURING TESTING
Information Patent Application
COB type IC package to enhanced bondibility of bumps embedded in su...
- Publication number 20070262439
- Publication date Nov 15, 2007
- ChipMOS Technologies (Bermuda) Ltd.
- Hsiang-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High frequency IC package and method for fabricating the same
- Publication number 20070235871
- Publication date Oct 11, 2007
- ChipMOS Technologies (Bermuda) Ltd.
- Hsiang-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system of transmitting information from one to many term...
- Publication number 20060285518
- Publication date Dec 21, 2006
- Newsoft Technology Corporation
- Yeong-shuenn Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
One to many transmission method and system to transmit real-time vi...
- Publication number 20040177377
- Publication date Sep 9, 2004
- NewSoft Technology Corporation
- Yeong-shuenn Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method and system for improving transmission efficiency of wireless...
- Publication number 20040125778
- Publication date Jul 1, 2004
- NewSoft Technology Corporation
- Yeong-shuenn Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Yeong-Jyh Lin

Person

Patents Grantslast 30 patents

Control system and control method

Zigzag-stacked package structure

COB type IC package to enhanced bondibility of bumps embedded in su...

High frequency IC package and method for fabricating the same

Optimal contention region allocation for medium access control in m...

Patents Applicationslast 30 patents

Zigzag-stacked package structure

Fabrication processes of a MEMS alloy probe

COB type IC package to enhanced bondibility of bumps embedded in su...

High frequency IC package and method for fabricating the same

Method and system of transmitting information from one to many term...

One to many transmission method and system to transmit real-time vi...

Method and system for improving transmission efficiency of wireless...