Yeongbeom Ko

Person

Gyeonggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including non-conductive film and method for...
- Patent number 12,015,005
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Yeongbeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of singulating semiconductor wafer...
- Patent number 8,936,969
- Issue date Jan 20, 2015
- STATS ChipPAC, Ltd.
- Hunteak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with ultra-thin chip and method...
- Patent number 8,716,108
- Issue date May 6, 2014
- Stats Chippac Ltd.
- Hun Teak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with an encapsulation and metho...
- Patent number 8,709,877
- Issue date Apr 29, 2014
- Stats Chippac Ltd.
- DaeWook Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with dielectric support and met...
- Patent number 8,546,957
- Issue date Oct 1, 2013
- Stats Chippac Ltd.
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240421140
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Sanghoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240413026
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Yeongbeom KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING NON-CONDUCTIVE FILM AND METHOD FOR...
- Publication number 20240297141
- Publication date Sep 5, 2024
- Samsung Electronics Co., Ltd.
- Yeongbeom KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240047296
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Yeongbeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20230420352
- Publication date Dec 28, 2023
- Samsung Electronics Co., Ltd.
- Yeongbeom KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230395547
- Publication date Dec 7, 2023
- Samsung Electronics Co., Ltd.
- Junyun Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230387088
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- YeongBeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STRUCTURE AND SEMICONDUCTOR DEVICE
- Publication number 20230260845
- Publication date Aug 17, 2023
- Samsung Electronics Co., Ltd.
- Junyun KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230082884
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- YeongBeom KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICOND...
- Publication number 20230082384
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Junho Yoon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230018676
- Publication date Jan 19, 2023
- Samsung Electronics Co., Ltd.
- YeongBeom KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING NON-CONDUCTIVE FILM AND METHOD FOR...
- Publication number 20220415842
- Publication date Dec 29, 2022
- Samsung Electronics Co., Ltd.
- Yeongbeom KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH AN ENCAPSULATION AND METHO...
- Publication number 20130334668
- Publication date Dec 19, 2013
- DaeWook Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Singulating Semiconductor Wafer...
- Publication number 20130249079
- Publication date Sep 26, 2013
- STATS ChipPAC, Ltd.
- Hunteak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ULTRA-THIN CHIP AND METHOD...
- Publication number 20130249117
- Publication date Sep 26, 2013
- Hun Teak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DIELECTRIC SUPPORT AND MET...
- Publication number 20120146246
- Publication date Jun 14, 2012
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS

Yeongbeom Ko

Person

Patents Grantslast 30 patents

Semiconductor package including non-conductive film and method for...

Semiconductor device and method of singulating semiconductor wafer...

Integrated circuit packaging system with ultra-thin chip and method...

Integrated circuit packaging system with an encapsulation and metho...

Integrated circuit packaging system with dielectric support and met...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE INCLUDING NON-CONDUCTIVE FILM AND METHOD FOR...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

WAFER STRUCTURE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICOND...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING NON-CONDUCTIVE FILM AND METHOD FOR...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH AN ENCAPSULATION AND METHO...

Semiconductor Device and Method of Singulating Semiconductor Wafer...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ULTRA-THIN CHIP AND METHOD...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DIELECTRIC SUPPORT AND MET...