Yeongbeom Ko

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Face-to-face semiconductor device with fan-out porch
- Patent number 12,051,684
- Issue date Jul 30, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor dies for semiconductor device assemblies
- Patent number 11,942,455
- Issue date Mar 26, 2024
- Micron Technology, Inc.
- Yeongbeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ground connection for semiconductor device assembly
- Patent number 11,764,161
- Issue date Sep 19, 2023
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-to-face semiconductor device with fan-out porch
- Patent number 11,749,665
- Issue date Sep 5, 2023
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-to-face semiconductor device with fan-out porch
- Patent number 11,456,289
- Issue date Sep 27, 2022
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor dies for semiconductor device assemblies
- Patent number 11,362,071
- Issue date Jun 14, 2022
- Micron Technology, Inc.
- Yeongbeom Ko
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH
- Publication number 20240387499
- Publication date Nov 21, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH
- Publication number 20230420440
- Publication date Dec 28, 2023
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DIES WITH PERIMETER PROFILES FOR S...
- Publication number 20230268229
- Publication date Aug 24, 2023
- Micron Technology, Inc.
- Yeongbeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH
- Publication number 20230013960
- Publication date Jan 19, 2023
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20220271013
- Publication date Aug 25, 2022
- Micron Technology, Inc.
- Yeongbeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20220059500
- Publication date Feb 24, 2022
- Micron Technology, Inc.
- Yeongbeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DIES WITH PERIMETER PROFILES FOR S...
- Publication number 20210202318
- Publication date Jul 1, 2021
- Micron Technology, Inc.
- Yeongbeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH
- Publication number 20210202454
- Publication date Jul 1, 2021
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUND CONNECTION FOR SEMICONDUCTOR DEVICE ASSEMBLY
- Publication number 20210175182
- Publication date Jun 10, 2021
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS

Yeongbeom Ko

Person

Patents Grantslast 30 patents

Face-to-face semiconductor device with fan-out porch

Stacked semiconductor dies for semiconductor device assemblies

Ground connection for semiconductor device assembly

Face-to-face semiconductor device with fan-out porch

Face-to-face semiconductor device with fan-out porch

Stacked semiconductor dies for semiconductor device assemblies

Patents Applicationslast 30 patents

FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH

FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH

METHODS OF FORMING SEMICONDUCTOR DIES WITH PERIMETER PROFILES FOR S...

FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH

STACKED SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSEMBLIES

STACKED SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSEMBLIES

METHODS OF FORMING SEMICONDUCTOR DIES WITH PERIMETER PROFILES FOR S...

FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH

GROUND CONNECTION FOR SEMICONDUCTOR DEVICE ASSEMBLY