Yeonglm Park

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Suwon, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming 3D semiconductor package...
- Patent number 9,391,046
- Issue date Jul 12, 2016
- STATS ChipPAC Pte. Ltd.
- Yeonglm Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with an integral-interposer-str...
- Patent number 8,710,634
- Issue date Apr 29, 2014
- Stats Chippac Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS