Yeongseok KIM

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal conductive film
- Patent number 12,183,653
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-conductive film sheet and semiconductor package including the same
- Patent number 12,062,633
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,057,425
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Eunyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film, semiconductor apparatus using the same, and semicond...
- Patent number 11,355,413
- Issue date Jun 7, 2022
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Flip chip bonding method
- Patent number 10,910,339
- Issue date Feb 2, 2021
- Samsung Electronics Co., Ltd.
- Hwail Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and semiconductor module
- Patent number 10,553,546
- Issue date Feb 4, 2020
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 10,297,554
- Issue date May 21, 2019
- Samsung Electronics Co., Ltd.
- Yeongseok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 10,211,163
- Issue date Feb 19, 2019
- Samsung Electronics Co., Ltd.
- Yeongseok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having mold layer with curved corner and meth...
- Patent number 10,147,713
- Issue date Dec 4, 2018
- Samsung Electronics Co., Ltd.
- Hyein Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a fan-out panel level package and a carrier t...
- Patent number 10,115,613
- Issue date Oct 30, 2018
- Samsung Electronics Co., Ltd.
- Won-Gi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor package having mold layer wit...
- Patent number 9,929,131
- Issue date Mar 27, 2018
- Samsung Electronics Co., Ltd.
- Hyein Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 9,922,935
- Issue date Mar 20, 2018
- Samsung Electronics Co., Ltd.
- Yeongseok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 9,418,943
- Issue date Aug 16, 2016
- Samsung Electronics Co., Ltd.
- Yeongseok Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE LOADING APPARATUS, SEMICONDUCTOR MANUFACTURING EQUIPMENT...
- Publication number 20240047253
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Sangho JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEBONDING TAPE AND METHOD OF PROCESSING SEMICONDUCTOR WAFER USING T...
- Publication number 20220384238
- Publication date Dec 1, 2022
- Samsung Electronics Co., Ltd.
- Seonho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220367401
- Publication date Nov 17, 2022
- Samsung Electronics Co., Ltd.
- Eunyeong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL CONDUCTIVE FILM
- Publication number 20220246491
- Publication date Aug 4, 2022
- Samsung Electronics Co., Ltd.
- Joungphil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-CONDUCTIVE FILM SHEET AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20220189902
- Publication date Jun 16, 2022
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING TAPE AND METHOD OF FABRICATING A SEMICONDUCTOR DEVICE US...
- Publication number 20220020627
- Publication date Jan 20, 2022
- Samsung Electronics Co., Ltd.
- HWAIL JIN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE FILM, SEMICONDUCTOR APPARATUS USING THE SAME, AND SEMICOND...
- Publication number 20200211920
- Publication date Jul 2, 2020
- Samsung Electronics Co., Ltd.
- Joungphil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP BONDING METHOD
- Publication number 20200058615
- Publication date Feb 20, 2020
- Samsung Electronics Co., Ltd.
- HWAIL JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR MODULE
- Publication number 20190198450
- Publication date Jun 27, 2019
- Samsung Electronics Co., Ltd.
- Joungphil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20180226354
- Publication date Aug 9, 2018
- Samsung Electronics Co., Ltd.
- Yeongseok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20180174979
- Publication date Jun 21, 2018
- Samsung Electronics Co., Ltd.
- Yeongseok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SAME
- Publication number 20180158810
- Publication date Jun 7, 2018
- Samsung Electronics Co., Ltd.
- Hyein YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A FAN-OUT PANEL LEVEL PACKAGE AND A CARRIER T...
- Publication number 20170358467
- Publication date Dec 14, 2017
- Samsung Electronics Co., Ltd.
- Won-Gi CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE
- Publication number 20170179098
- Publication date Jun 22, 2017
- Samsung Electronics Co., Ltd.
- Hyein YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20160336275
- Publication date Nov 17, 2016
- Samsung Electronics Co., Ltd.
- Yeongseok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160079178
- Publication date Mar 17, 2016
- Samsung Electronics Co., Ltd.
- Yeongseok Kim
- H01 - BASIC ELECTRIC ELEMENTS

Yeongseok KIM

Person

Patents Grantslast 30 patents

Thermal conductive film

Non-conductive film sheet and semiconductor package including the same

Semiconductor package

Adhesive film, semiconductor apparatus using the same, and semicond...

Flip chip bonding method

Semiconductor package and semiconductor module

Semiconductor package and method of fabricating the same

Semiconductor package and method of fabricating the same

Semiconductor package having mold layer with curved corner and meth...

Method of fabricating a fan-out panel level package and a carrier t...

Method of fabricating a semiconductor package having mold layer wit...

Semiconductor package and method of fabricating the same

Semiconductor package and method of manufacturing the same

Patents Applicationslast 30 patents

SUBSTRATE LOADING APPARATUS, SEMICONDUCTOR MANUFACTURING EQUIPMENT...

DEBONDING TAPE AND METHOD OF PROCESSING SEMICONDUCTOR WAFER USING T...

SEMICONDUCTOR PACKAGE

THERMAL CONDUCTIVE FILM

NON-CONDUCTIVE FILM SHEET AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

PROCESSING TAPE AND METHOD OF FABRICATING A SEMICONDUCTOR DEVICE US...

ADHESIVE FILM, SEMICONDUCTOR APPARATUS USING THE SAME, AND SEMICOND...

FLIP CHIP BONDING METHOD

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SAME

METHOD OF FABRICATING A FAN-OUT PANEL LEVEL PACKAGE AND A CARRIER T...

METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME