Yeonjin LEE

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices including a thick metal layer and a bump
- Patent number 12,080,663
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection pad structure for analysis in a semiconductor device
- Patent number 12,072,374
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Jihoon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,948,882
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Jihoon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a thick metal layer and a bump
- Patent number 11,817,408
- Issue date Nov 14, 2023
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including low-k dielectric layer
- Patent number 11,776,894
- Issue date Oct 3, 2023
- Samsung Electronics Co., Ltd.
- Yeonjin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including scribe lane and method of manufactu...
- Patent number 11,756,843
- Issue date Sep 12, 2023
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,670,559
- Issue date Jun 6, 2023
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,587,897
- Issue date Feb 21, 2023
- Samsung Electronics Co., Ltd.
- Joongwon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a thick metal layer and a bump
- Patent number 11,557,556
- Issue date Jan 17, 2023
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,495,533
- Issue date Nov 8, 2022
- Samsung Electronics Co., Ltd.
- Jihoon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,476,220
- Issue date Oct 18, 2022
- Samsung Electronics Co., Ltd.
- Jimin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including scribe lane and method of manufactu...
- Patent number 11,342,235
- Issue date May 24, 2022
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a thick metal layer and a bump
- Patent number 11,049,827
- Issue date Jun 29, 2021
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES HAVING UPPER CONDUCTIVE PATTERNS AND SEMICOND...
- Publication number 20240332228
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Joongwon SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240282752
- Publication date Aug 22, 2024
- Samsung Electronics Co., Ltd.
- Yeonjin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING TEST PADS
- Publication number 20240145317
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Joongwon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240113077
- Publication date Apr 4, 2024
- Samsung Electronics Co., Ltd.
- Nara LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240103070
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Yeonjin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP
- Publication number 20240047390
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Minjung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CHIP
- Publication number 20240038675
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Jimin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING LOW-K DIELECTRIC LAYER
- Publication number 20230230915
- Publication date Jul 20, 2023
- Samsung Electronics Co., Ltd.
- Yeonjin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP
- Publication number 20230154876
- Publication date May 18, 2023
- Samsung Electronics Co., Ltd.
- Minjung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230138616
- Publication date May 4, 2023
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH-SILICON VIA AND METHOD OF FO...
- Publication number 20230116911
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Jeonil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20230077803
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Jimin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CRACK-PREVENTING STRUCTURE
- Publication number 20230067386
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- MINJUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230043650
- Publication date Feb 9, 2023
- Samsung Electronics Co., Ltd.
- Jihoon CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230030117
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- Juik LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VIA STRUCTURE AND METHOD FOR MANUFAC...
- Publication number 20230005818
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- Yeonjin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTION PAD STRUCTURE FOR ANALYSIS IN A SEMICONDUCTOR DEVICE
- Publication number 20220326301
- Publication date Oct 13, 2022
- Samsung Electronics Co., Ltd.
- Jihoon CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING SCRIBE LANE AND METHOD OF MANUFACTU...
- Publication number 20220223485
- Publication date Jul 14, 2022
- Samsung Electronics Co., Ltd.
- Minjung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210305188
- Publication date Sep 30, 2021
- Samsung Electronics Co., Ltd.
- JOONGWON SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20210305190
- Publication date Sep 30, 2021
- Samsung Electronics Co., Ltd.
- Jimin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20210305153
- Publication date Sep 30, 2021
- Samsung Electronics Co., Ltd.
- Jihoon CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210305115
- Publication date Sep 30, 2021
- Samsung Electronics Co., Ltd.
- Minjung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP
- Publication number 20210280541
- Publication date Sep 9, 2021
- Samsung Electronics Co., Ltd.
- Minjung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING SCRIBE LANE AND METHOD OF MANUFACTU...
- Publication number 20210175133
- Publication date Jun 10, 2021
- Samsung Electronics Co., Ltd.
- Minjung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING LOW-K DIELECTRIC LAYER
- Publication number 20210057328
- Publication date Feb 25, 2021
- Samsung Electronics Co., Ltd.
- Yeonjin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP
- Publication number 20210043591
- Publication date Feb 11, 2021
- Samsung Electronics Co., Ltd.
- Minjung CHOI
- H01 - BASIC ELECTRIC ELEMENTS

Yeonjin LEE

Person

Patents Grantslast 30 patents

Semiconductor devices including a thick metal layer and a bump

Detection pad structure for analysis in a semiconductor device

Semiconductor device and method of fabricating the same

Semiconductor devices including a thick metal layer and a bump

Semiconductor chip including low-k dielectric layer

Semiconductor devices including scribe lane and method of manufactu...

Semiconductor device

Semiconductor device

Semiconductor devices including a thick metal layer and a bump

Semiconductor device and method of fabricating the same

Semiconductor packages

Semiconductor devices including scribe lane and method of manufactu...

Semiconductor devices including a thick metal layer and a bump

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES HAVING UPPER CONDUCTIVE PATTERNS AND SEMICOND...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES HAVING TEST PADS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CHIP

SEMICONDUCTOR CHIP INCLUDING LOW-K DIELECTRIC LAYER

SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE INCLUDING THROUGH-SILICON VIA AND METHOD OF FO...

SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE WITH CRACK-PREVENTING STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING VIA STRUCTURE AND METHOD FOR MANUFAC...

DETECTION PAD STRUCTURE FOR ANALYSIS IN A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES INCLUDING SCRIBE LANE AND METHOD OF MANUFACTU...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP

SEMICONDUCTOR DEVICES INCLUDING SCRIBE LANE AND METHOD OF MANUFACTU...

SEMICONDUCTOR CHIP INCLUDING LOW-K DIELECTRIC LAYER

SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP