Yeow Meng Teo

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Flip chip LED with side reflectors encasing side surfaces of a semi...
- Patent number 12,057,535
- Issue date Aug 6, 2024
- Lumileds LLC
- Iwan-Wahyu Saputra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of making flip chip micro light emitting diodes
- Patent number 12,040,423
- Issue date Jul 16, 2024
- Lumileds LLC
- Yeow Meng Teo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip LED with side reflectors encasing side surfaces of a semi...
- Patent number 12,015,110
- Issue date Jun 18, 2024
- Lumileds LLC
- Iwan-Wahyu Saputra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip micro light emitting diodes
- Patent number 11,955,583
- Issue date Apr 9, 2024
- Lumileds LLC
- Yeow Meng Teo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode devices with defined hard mask opening
- Patent number 11,784,286
- Issue date Oct 10, 2023
- Lumileds LLC
- Erik William Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of making flip chip micro light emitting diodes
- Patent number 11,705,534
- Issue date Jul 18, 2023
- Lumileds LLC
- Yeow Meng Teo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode devices with defined hard mask opening
- Patent number 11,569,415
- Issue date Jan 31, 2023
- Lumileds LLC
- Erik William Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip LED with side reflectors and phosphor
- Patent number 11,424,396
- Issue date Aug 23, 2022
- Lumileds LLC
- Iwan-Wahyu Saputra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact etching and metallization for improved LED device performan...
- Patent number 10,916,683
- Issue date Feb 9, 2021
- Lumileds LLC
- David Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method using ultraviolet radiation for integrated circuit manufactu...
- Patent number 6,607,993
- Issue date Aug 19, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Ronald Dickinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating an antifuse element
- Patent number 6,368,900
- Issue date Apr 9, 2002
- Chartered Semiconductor Manufacturing Ltd.
- John Prasao Kenkaraseril
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming top metal contact to antifuse
- Patent number 6,362,102
- Issue date Mar 26, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Say Gut Piew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming salicided poly to metal capacitor
- Patent number 6,306,721
- Issue date Oct 23, 2001
- Chartered Semiconductor Maufacturing Ltd.
- Yeow Meng Teo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming contacts and vias with improved barrier metal st...
- Patent number 5,970,374
- Issue date Oct 19, 1999
- Chartered Semiconductor Manufacturing Ltd.
- Yeow Meng Teo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming stacked polysilicon
- Patent number 5,895,264
- Issue date Apr 20, 1999
- Chartered Semiconductor Manufacturing Ltd.
- Yeow Meng Teo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked container capacitor using chemical mechanical polishing
- Patent number 5,808,855
- Issue date Sep 15, 1998
- Chartered Semiconductor Manufacturing Pte Ltd
- Lap Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked container capacitor using chemical mechanical polishing
- Patent number 5,627,094
- Issue date May 6, 1997
- Chartered Semiconductor Manufacturing Pte, Ltd.
- Lap Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making electrical local interconnects
- Patent number 5,624,871
- Issue date Apr 29, 1997
- Chartered Semiconductor Manufacturing Pte Ltd
- Yeow M. Teo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods Of Making Flip Chip Micro Light Emitting Diodes
- Publication number 20230299227
- Publication date Sep 21, 2023
- Lumileds LLC
- Yeow Meng Teo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light Emitting Diode Devices With Defined Hard Mask Opening
- Publication number 20230104020
- Publication date Apr 6, 2023
- Lumileds LLC
- Erik William Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DEVICES WITH BONDING AND/OR OHMIC CONTACT-REFL...
- Publication number 20230074920
- Publication date Mar 9, 2023
- Lumileds LLC
- Wali Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL STACKS FOR LIGHT EMITTING DIODES FOR BONDING AND/OR OHMIC CON...
- Publication number 20230075707
- Publication date Mar 9, 2023
- Wali Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DEVICES WITH BONDING AND/OR OHMIC CONTACT-REFL...
- Publication number 20230072512
- Publication date Mar 9, 2023
- Lumileds LLC
- Wali Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP LED WITH SIDE REFLECTORS AND PHOSPHOR
- Publication number 20220399483
- Publication date Dec 15, 2022
- Lumileds LLC
- Iwan-Wahyu SAPUTRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip Chip Micro Light Emitting Diodes
- Publication number 20220173276
- Publication date Jun 2, 2022
- Lumileds LLC
- Yeow Meng Teo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods Of Making Flip Chip Micro Light Emitting Diodes
- Publication number 20220173267
- Publication date Jun 2, 2022
- Lumileds LLC
- Yeow Meng Teo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light Emitting Diode Devices With Defined Hard Mask Opening
- Publication number 20210288214
- Publication date Sep 16, 2021
- Lumileds LLC
- Erik William Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT ETCHING AND METALLIZATION FOR IMPROVED LED DEVICE PERFORMAN...
- Publication number 20200144454
- Publication date May 7, 2020
- Lumileds Holding B.V.
- David CHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP LED WITH SIDE REFLECTORS AND PHOSPHOR
- Publication number 20190027662
- Publication date Jan 24, 2019
- Lumileds Holding B.V.
- Iwan-Wahyu SAPUTRA
- H01 - BASIC ELECTRIC ELEMENTS

Yeow Meng Teo

Person

Patents Grantslast 30 patents

Flip chip LED with side reflectors encasing side surfaces of a semi...

Methods of making flip chip micro light emitting diodes

Flip chip LED with side reflectors encasing side surfaces of a semi...

Flip chip micro light emitting diodes

Light emitting diode devices with defined hard mask opening

Methods of making flip chip micro light emitting diodes

Light emitting diode devices with defined hard mask opening

Flip chip LED with side reflectors and phosphor

Contact etching and metallization for improved LED device performan...

Method using ultraviolet radiation for integrated circuit manufactu...

Method of fabricating an antifuse element

Method of forming top metal contact to antifuse

Method of forming salicided poly to metal capacitor

Method for forming contacts and vias with improved barrier metal st...

Method for forming stacked polysilicon

Stacked container capacitor using chemical mechanical polishing

Stacked container capacitor using chemical mechanical polishing

Method for making electrical local interconnects

Patents Applicationslast 30 patents

Methods Of Making Flip Chip Micro Light Emitting Diodes

Light Emitting Diode Devices With Defined Hard Mask Opening

LIGHT EMITTING DIODE DEVICES WITH BONDING AND/OR OHMIC CONTACT-REFL...

METAL STACKS FOR LIGHT EMITTING DIODES FOR BONDING AND/OR OHMIC CON...

LIGHT EMITTING DIODE DEVICES WITH BONDING AND/OR OHMIC CONTACT-REFL...

FLIP CHIP LED WITH SIDE REFLECTORS AND PHOSPHOR

Flip Chip Micro Light Emitting Diodes

Methods Of Making Flip Chip Micro Light Emitting Diodes

Light Emitting Diode Devices With Defined Hard Mask Opening

CONTACT ETCHING AND METALLIZATION FOR IMPROVED LED DEVICE PERFORMAN...

FLIP CHIP LED WITH SIDE REFLECTORS AND PHOSPHOR