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Yeu Wen Lee
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Seremban, MY
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor component and method of manufacture
Patent number
8,461,670
Issue date
Jun 11, 2013
Semiconductor Components Industries, LLC
Phillip Celaya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure having enhanced thermal dissipation...
Patent number
7,755,179
Issue date
Jul 13, 2010
Semiconductor Components Industries, LLC
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and leadframe therefor having angled corners
Patent number
7,247,931
Issue date
Jul 24, 2007
Semiconductor Components Industries, LLC
Chuan Kiak Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for making a direct chip attach device and structure
Patent number
7,144,538
Issue date
Dec 5, 2006
Semiconductor Components Industries, LLC
Yeu Wen Lee
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Method of forming a leadframe for a semiconductor package
Patent number
7,105,378
Issue date
Sep 12, 2006
Semiconductor Components Industries, LLC
Chuan Kiak Ng
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
Publication number
20110298115
Publication date
Dec 8, 2011
Phillip Celaya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package Structure Having Enhanced Thermal Dissipation...
Publication number
20080246130
Publication date
Oct 9, 2008
Semiconductor Components Industries, LLC
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of forming a semiconductor package and leadframe therefor
Publication number
20060263940
Publication date
Nov 23, 2006
Chuan Kiak Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of forming a semiconductor package and leadframe therefor
Publication number
20050179118
Publication date
Aug 18, 2005
Semiconductor Components Industries, LLC.
Chuan Kiak Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for making a direct chip attach device and structure
Publication number
20040262811
Publication date
Dec 30, 2004
Semiconductor Components Industries, LLC.
Yeu Wen Lee
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL