Yew Wee Cheong

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Penang, MY

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Patents Grantslast 30 patents

Information Patent Grant
Die molding for flip chip molded matrix array package using UV cura...
- Patent number 7,465,368
- Issue date Dec 16, 2008
- Intel Corporation
- Szu Shing Lim
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Wafer grinding method
- Patent number 7,210,987
- Issue date May 1, 2007
- Intel Corporation
- Yew Wee Cheong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate grooves to reduce underfill fillet bridging
- Patent number 7,179,683
- Issue date Feb 20, 2007
- Intel Corporation
- Al Ling Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for controlled fracture substrate singulation
- Patent number 7,172,951
- Issue date Feb 6, 2007
- Intel Corporation
- Oi Fong Chin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Controlled fracture substrate singulation
- Patent number 7,005,317
- Issue date Feb 28, 2006
- Intel Corporation
- Oi Fong Chin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of thinning a wafer utilizing a laminated reinforcing layer...
- Patent number 6,713,366
- Issue date Mar 30, 2004
- Intel Corporation
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE MOLDING FOR FLIP CHIP MOLDED MATRIX ARRAY PACKAGE USING UV CURA...
- Publication number 20090025882
- Publication date Jan 29, 2009
- Intel Corporation
- Szu Shing Lim
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Apparatus for controlled fracture substrate singulation
- Publication number 20060084241
- Publication date Apr 20, 2006
- Oi Fong Chin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low-K interlayer dielectric wafer grinding
- Publication number 20050221728
- Publication date Oct 6, 2005
- Yew Wee Cheong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Combination back grind tape and underfill for flip chips
- Publication number 20050126686
- Publication date Jun 16, 2005
- Yew Wee Cheong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Controlled fracture substrate singulation
- Publication number 20050101109
- Publication date May 12, 2005
- Oi Fong Chin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF THINNING A WAFER UTILIZING A LAMINATED REINFORCING LAYER...
- Publication number 20030235937
- Publication date Dec 25, 2003
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS