Yezdi N. Dordi

Person

Palo Alt, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Zincating and doping of metal liner for liner passivation and adhes...
- Patent number 11,984,354
- Issue date May 14, 2024
- Lam Research Corporation
- Aniruddha Joi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal liner passivation and adhesion enhancement by zinc doping
- Patent number 11,424,158
- Issue date Aug 23, 2022
- Lam Research Corporation
- Yezdi N. Dordi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical doping of thin metal layers employing underpotentia...
- Patent number 11,225,714
- Issue date Jan 18, 2022
- Lam Research Corporation
- Kailash Venkatraman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal liner passivation and adhesion enhancement by zinc doping
- Patent number 10,741,440
- Issue date Aug 11, 2020
- Lam Research Corporation
- Yezdi N. Dordi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Selective electroless electrochemical atomic layer deposition in an...
- Patent number 10,640,874
- Issue date May 5, 2020
- Lam Research Corporation
- Aniruddha Joi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Layer-by-layer deposition using hydrogen
- Patent number 10,508,351
- Issue date Dec 17, 2019
- Lam Research Corporation
- Aniruddha Joi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrochemical doping of thin metal layers employing underpotentia...
- Patent number 10,501,846
- Issue date Dec 10, 2019
- Lam Research Corporation
- Kailash Venkatraman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-forming barrier process
- Patent number 10,483,163
- Issue date Nov 19, 2019
- Lam Research Corporation
- Aniruddha Joi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlevel conductor pre-fill utilizing selective barrier deposition
- Patent number 10,262,943
- Issue date Apr 16, 2019
- Lam Research Corporation
- Artur Kolics
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-forming barrier process
- Patent number 10,163,695
- Issue date Dec 25, 2018
- Lam Research Corporation
- Aniruddha Joi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlevel conductor pre-fill utilizing selective barrier deposition
- Patent number 9,875,968
- Issue date Jan 23, 2018
- Lam Research Corporation
- Artur Kolics
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlevel conductor pre-fill utilizing selective barrier deposition
- Patent number 9,583,386
- Issue date Feb 28, 2017
- Lam Research Corporation
- Artur Kolics
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless deposition of continuous platinum layer using complexed...
- Patent number 9,499,913
- Issue date Nov 22, 2016
- Lam Research Corporation
- Eugenijus Norkus
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective deposition and co-deposition processes for ferromagnetic...
- Patent number 9,476,124
- Issue date Oct 25, 2016
- Lam Research Corporation
- Aniruddha Joi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless deposition of continuous platinum layer
- Patent number 9,469,902
- Issue date Oct 18, 2016
- Lam Research Corporation
- Eugenijus Norkus
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless deposition of continuous cobalt layer using complexed T...
- Patent number 9,428,836
- Issue date Aug 30, 2016
- Lam Research Corporation
- Eugenijus Norkus
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method for atomic layer deposition
- Patent number 9,359,673
- Issue date Jun 7, 2016
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for wafer electroless plating
- Patent number 9,287,110
- Issue date Mar 15, 2016
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Controlled ambient system for interface engineering
- Patent number 9,117,860
- Issue date Aug 25, 2015
- Lam Research Corporation
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process integration scheme to lower overall dielectric constant in...
- Patent number 9,076,844
- Issue date Jul 7, 2015
- Lam Research Corporation
- Nicolas Bright
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for barrier interface preparation of copper interconnect
- Patent number 8,916,232
- Issue date Dec 23, 2014
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for removing a metal oxide from a substrate
- Patent number 8,883,027
- Issue date Nov 11, 2014
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluid handling system for wafer electroless plating and associated...
- Patent number 8,844,461
- Issue date Sep 30, 2014
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of etching an etch layer
- Patent number 8,822,344
- Issue date Sep 2, 2014
- Lam Research Corporation
- Yezdi N. Dordi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes and systems for engineering a copper surface for selectiv...
- Patent number 8,771,804
- Issue date Jul 8, 2014
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Processes and systems for engineering a silicon-type surface for se...
- Patent number 8,747,960
- Issue date Jun 10, 2014
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatuses for three dimensional integrated circuits
- Patent number 8,673,769
- Issue date Mar 18, 2014
- Lam Research Corporation
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simultaneous electroless plating of two substrates
- Patent number 8,622,020
- Issue date Jan 7, 2014
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for atomic layer deposition
- Patent number 8,623,456
- Issue date Jan 7, 2014
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless copper deposition
- Patent number 8,524,329
- Issue date Sep 3, 2013
- Lam Research Corporation
- Yezdi N. Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
DOPING PROCESSES IN METAL INTERCONNECT STRUCTURES
- Publication number 20220415819
- Publication date Dec 29, 2022
- LAM RESEARCH CORPORATION
- Aniruddha Joi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ZINCATING AND DOPING OF METAL LINER FOR LINER PASSIVATION AND ADHES...
- Publication number 20210166971
- Publication date Jun 3, 2021
- LAM RESEARCH CORPORATION
- Aniruddha Joi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL LINER PASSIVATION AND ADHESION ENHANCEMENT BY ZINC DOPING
- Publication number 20200365453
- Publication date Nov 19, 2020
- LAM RESEARCH CORPORATION
- Yezdi N. DORDI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL DOPING OF THIN METAL LAYERS EMPLOYING UNDERPOTENTIA...
- Publication number 20200063256
- Publication date Feb 27, 2020
- LAM RESEARCH CORPORATION
- Kailash Venkatraman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL LINER PASSIVATION AND ADHESION ENHANCEMENT BY ZINC DOPING
- Publication number 20190371659
- Publication date Dec 5, 2019
- LAM RESEARCH CORPORATION
- Yezdi N. DORDI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA PREFILL IN A FULLY ALIGNED VIA
- Publication number 20190363048
- Publication date Nov 28, 2019
- LAM RESEARCH CORPORATION
- Lie Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-FORMING BARRIER PROCESS
- Publication number 20190122922
- Publication date Apr 25, 2019
- LAM RESEARCH CORPORATION
- Aniruddha Joi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCHEMICAL DOPING OF THIN METAL LAYERS EMPLOYING UNDERPOTENTIA...
- Publication number 20190078202
- Publication date Mar 14, 2019
- LAM RESEARCH CORPORATION
- Kailash Venkatraman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE ELECTROLESS ELECTROCHEMICAL ATOMIC LAYER DEPOSITION IN AN...
- Publication number 20190048472
- Publication date Feb 14, 2019
- LAM RESEARCH CORPORATION
- Aniruddha Joi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-FORMING BARRIER PROCESS
- Publication number 20180374747
- Publication date Dec 27, 2018
- LAM RESEARCH CORPORATION
- Aniruddha Joi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER-BY-LAYER DEPOSITION USING HYDROGEN
- Publication number 20180266001
- Publication date Sep 20, 2018
- LAM RESEARCH CORPORATION
- Aniruddha Joi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Interlevel Conductor Pre-Fill Utilizing Selective Barrier Deposition
- Publication number 20180151503
- Publication date May 31, 2018
- LAM RESEARCH CORPORATION
- Artur Kolics
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interlevel Conductor Pre-Fill Utilizing Selective Barrier Deposition
- Publication number 20170162512
- Publication date Jun 8, 2017
- LAM RESEARCH CORPORATION
- Artur Kolics
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR A NON-AQUEOUS ELECTROLESS POLYOL DEPOSITION OF METAL OR...
- Publication number 20170073815
- Publication date Mar 16, 2017
- LAM RESEARCH CORPORATION
- Mehul N. Patel
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
HIGHLY SELECTIVE DEPOSITION OF AMORPHOUS CARBON AS A METAL DIFFUSIO...
- Publication number 20160329213
- Publication date Nov 10, 2016
- LAM RESEARCH CORPORATION
- Wei Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION AND CO-DEPOSITION PROCESSES FOR FERROMAGNETIC...
- Publication number 20160194761
- Publication date Jul 7, 2016
- LAM RESEARCH CORPORATION
- Aniruddha Joi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Interlevel Conductor Pre-Fill Utilizing Selective Barrier Deposition
- Publication number 20160118296
- Publication date Apr 28, 2016
- LAM RESEARCH CORPORATION
- Artur Kolics
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS DEPOSITION OF CONTINUOUS PALLADIUM LAYER USING COMPLEXE...
- Publication number 20150307995
- Publication date Oct 29, 2015
- LAM RESEARCH CORPORATION
- Eugenijus NORKUS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLESS DEPOSITION OF CONTINUOUS COBALT LAYER USING COMPLEXED T...
- Publication number 20150307993
- Publication date Oct 29, 2015
- LAM RESEARCH CORPORATION
- Eugenijus NORKUS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLESS DEPOSITION OF CONTINUOUS NICKEL LAYER USING COMPLEXED T...
- Publication number 20150307994
- Publication date Oct 29, 2015
- LAM RESEARCH CORPORATION
- Eugenijus NORKUS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLESS DEPOSITION OF CONTINUOUS PLATINUM LAYER USING COMPLEXED...
- Publication number 20150284857
- Publication date Oct 8, 2015
- LAM RESEARCH CORPORATION
- Eugenijus NORKUS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLESS DEPOSITION OF CONTINUOUS PLATINUM LAYER
- Publication number 20150232995
- Publication date Aug 20, 2015
- LAM RESEARCH CORPORATION
- Eugenijus NORKUS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESSES AND SYSTEMS FOR ENGINEERING A BARRIER SURFACE FOR COPPER...
- Publication number 20150214093
- Publication date Jul 30, 2015
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR BARRIER INTERFACE PREPARATION OF COPPER INTERCONNECT
- Publication number 20150132946
- Publication date May 14, 2015
- LAM RESEARCH CORPORATION
- Hyungsuk Alexander Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BARRIER INTERFACE PREPARATION OF COPPER INTERCONNECT
- Publication number 20150128861
- Publication date May 14, 2015
- LAM RESEARCH CORPORATION
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEM AND METHOD FOR FORMING PATTERNED COPPER LINES THROUGH ELECTR...
- Publication number 20150034589
- Publication date Feb 5, 2015
- LAM RESEARCH CORPORATION
- Alan Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSES AND SYSTEMS FOR ENGINEERING A COPPER SURFACE FOR SELECTIV...
- Publication number 20140322446
- Publication date Oct 30, 2014
- Yezdi Dordi
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METHOD OF ETCHING AN ETCH LAYER
- Publication number 20140256142
- Publication date Sep 11, 2014
- LAM RESEARCH CORPORATION
- Yezdi N. DORDI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ACTIVATION OF RUTHENIUM CONTAINING LINER/BARRIER
- Publication number 20140154406
- Publication date Jun 5, 2014
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUSES FOR THREE DIMENSIONAL INTEGRATED CIRCUITS
- Publication number 20140145334
- Publication date May 29, 2014
- John BOYD
- H01 - BASIC ELECTRIC ELEMENTS

Yezdi N. Dordi

Person

Patents Grantslast 30 patents

Zincating and doping of metal liner for liner passivation and adhes...

Metal liner passivation and adhesion enhancement by zinc doping

Electrochemical doping of thin metal layers employing underpotentia...

Metal liner passivation and adhesion enhancement by zinc doping

Selective electroless electrochemical atomic layer deposition in an...

Layer-by-layer deposition using hydrogen

Electrochemical doping of thin metal layers employing underpotentia...

Self-forming barrier process

Interlevel conductor pre-fill utilizing selective barrier deposition

Self-forming barrier process

Interlevel conductor pre-fill utilizing selective barrier deposition

Interlevel conductor pre-fill utilizing selective barrier deposition

Electroless deposition of continuous platinum layer using complexed...

Selective deposition and co-deposition processes for ferromagnetic...

Electroless deposition of continuous platinum layer

Electroless deposition of continuous cobalt layer using complexed T...

Apparatus and method for atomic layer deposition

Method and apparatus for wafer electroless plating

Controlled ambient system for interface engineering

Process integration scheme to lower overall dielectric constant in...

Method for barrier interface preparation of copper interconnect

Methods for removing a metal oxide from a substrate

Fluid handling system for wafer electroless plating and associated...

Method of etching an etch layer

Processes and systems for engineering a copper surface for selectiv...

Processes and systems for engineering a silicon-type surface for se...

Methods and apparatuses for three dimensional integrated circuits

Simultaneous electroless plating of two substrates

Methods for atomic layer deposition

Electroless copper deposition

Patents Applicationslast 30 patents

DOPING PROCESSES IN METAL INTERCONNECT STRUCTURES

ZINCATING AND DOPING OF METAL LINER FOR LINER PASSIVATION AND ADHES...

METAL LINER PASSIVATION AND ADHESION ENHANCEMENT BY ZINC DOPING

ELECTROCHEMICAL DOPING OF THIN METAL LAYERS EMPLOYING UNDERPOTENTIA...

METAL LINER PASSIVATION AND ADHESION ENHANCEMENT BY ZINC DOPING

VIA PREFILL IN A FULLY ALIGNED VIA

SELF-FORMING BARRIER PROCESS

ELECTROCHEMICAL DOPING OF THIN METAL LAYERS EMPLOYING UNDERPOTENTIA...

SELECTIVE ELECTROLESS ELECTROCHEMICAL ATOMIC LAYER DEPOSITION IN AN...

SELF-FORMING BARRIER PROCESS

LAYER-BY-LAYER DEPOSITION USING HYDROGEN

Interlevel Conductor Pre-Fill Utilizing Selective Barrier Deposition

Interlevel Conductor Pre-Fill Utilizing Selective Barrier Deposition

METHOD FOR A NON-AQUEOUS ELECTROLESS POLYOL DEPOSITION OF METAL OR...

HIGHLY SELECTIVE DEPOSITION OF AMORPHOUS CARBON AS A METAL DIFFUSIO...

SELECTIVE DEPOSITION AND CO-DEPOSITION PROCESSES FOR FERROMAGNETIC...

Interlevel Conductor Pre-Fill Utilizing Selective Barrier Deposition

ELECTROLESS DEPOSITION OF CONTINUOUS PALLADIUM LAYER USING COMPLEXE...

ELECTROLESS DEPOSITION OF CONTINUOUS COBALT LAYER USING COMPLEXED T...

ELECTROLESS DEPOSITION OF CONTINUOUS NICKEL LAYER USING COMPLEXED T...

ELECTROLESS DEPOSITION OF CONTINUOUS PLATINUM LAYER USING COMPLEXED...

ELECTROLESS DEPOSITION OF CONTINUOUS PLATINUM LAYER

PROCESSES AND SYSTEMS FOR ENGINEERING A BARRIER SURFACE FOR COPPER...

METHODS FOR BARRIER INTERFACE PREPARATION OF COPPER INTERCONNECT

APPARATUS FOR BARRIER INTERFACE PREPARATION OF COPPER INTERCONNECT

SYSTEM AND METHOD FOR FORMING PATTERNED COPPER LINES THROUGH ELECTR...

PROCESSES AND SYSTEMS FOR ENGINEERING A COPPER SURFACE FOR SELECTIV...

METHOD OF ETCHING AN ETCH LAYER

WET ACTIVATION OF RUTHENIUM CONTAINING LINER/BARRIER

METHODS AND APPARATUSES FOR THREE DIMENSIONAL INTEGRATED CIRCUITS