Yi Amy Xia

Person

Campbell, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Optical leak detection of liquid cooling components within an elect...
- Patent number 12,169,180
- Issue date Dec 17, 2024
- Intel Corporation
- Prabhakar Subrahmanyam
- G01 - MEASURING TESTING
Information Patent Grant
Thermal control for processor-based devices
- Patent number 11,917,790
- Issue date Feb 27, 2024
- Intel Corporation
- Prabhakar Subrahmanyam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Test, validation, and debug architecture
- Patent number 10,198,333
- Issue date Feb 5, 2019
- Intel Corporation
- Mark B. Trobough
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
HYBRID COOLER TO THERMALLY COOL SEMICONDUCTOR DEVICES INSIDE AND OU...
- Publication number 20240244800
- Publication date Jul 18, 2024
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNOLOGIES FOR ISOLATED HEAT DISSIPATING DEVICES
- Publication number 20230420338
- Publication date Dec 28, 2023
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COLD PLATES FOR SECONDARY SIDE COMPONENTS OF PRINTED CIRCUIT BOARDS
- Publication number 20230422389
- Publication date Dec 28, 2023
- Intel Corporation
- Prabhakar Subrahmanyam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND APPARATUS FOR AN AUTONOMOUS STAGE-SWITCHING MULTI-STAGE...
- Publication number 20230025369
- Publication date Jan 26, 2023
- Prabhakar Subrahmanyam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THIN FORM FACTOR ASSEMBLIES FOR COOLING DIMMS
- Publication number 20220225542
- Publication date Jul 14, 2022
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- G11 - INFORMATION STORAGE
Information Patent Application
LIQUID COOLING SYSTEM LEAK DETECTION IMPROVEMENTS
- Publication number 20220196507
- Publication date Jun 23, 2022
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENHANCED ELECTRONIC PACKAGE THERMAL DISSIPATION WITH IN-SITU TRANSP...
- Publication number 20220117112
- Publication date Apr 14, 2022
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNABLE STACK-UP DIMM FORM FACTOR COLD PLATE WITH EMBEDDED PELTIER...
- Publication number 20220077023
- Publication date Mar 10, 2022
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL CONTROL FOR PROCESSOR-BASED DEVICES
- Publication number 20210289659
- Publication date Sep 16, 2021
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELF COOLING ADAPTIVE FLOW BRANCHING HEAT EXCHANGER SYSTEM FOR COOL...
- Publication number 20210120703
- Publication date Apr 22, 2021
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL LEAK DETECTION OF LIQUID COOLING COMPONENTS WITHIN AN ELECT...
- Publication number 20210116391
- Publication date Apr 22, 2021
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- G01 - MEASURING TESTING
Information Patent Application
TEST, VALIDATION, AND DEBUG ARCHITECTURE
- Publication number 20150127983
- Publication date May 7, 2015
- Intel Corporation
- Mark B. Trobough
- G06 - COMPUTING CALCULATING COUNTING

Person

Patents Grantslast 30 patents

Optical leak detection of liquid cooling components within an elect...

Thermal control for processor-based devices

Test, validation, and debug architecture

Patents Applicationslast 30 patents

HYBRID COOLER TO THERMALLY COOL SEMICONDUCTOR DEVICES INSIDE AND OU...

TECHNOLOGIES FOR ISOLATED HEAT DISSIPATING DEVICES

COLD PLATES FOR SECONDARY SIDE COMPONENTS OF PRINTED CIRCUIT BOARDS

METHODS AND APPARATUS FOR AN AUTONOMOUS STAGE-SWITCHING MULTI-STAGE...

THIN FORM FACTOR ASSEMBLIES FOR COOLING DIMMS

LIQUID COOLING SYSTEM LEAK DETECTION IMPROVEMENTS

ENHANCED ELECTRONIC PACKAGE THERMAL DISSIPATION WITH IN-SITU TRANSP...

TUNABLE STACK-UP DIMM FORM FACTOR COLD PLATE WITH EMBEDDED PELTIER...

THERMAL CONTROL FOR PROCESSOR-BASED DEVICES

SELF COOLING ADAPTIVE FLOW BRANCHING HEAT EXCHANGER SYSTEM FOR COOL...

OPTICAL LEAK DETECTION OF LIQUID COOLING COMPONENTS WITHIN AN ELECT...

TEST, VALIDATION, AND DEBUG ARCHITECTURE