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Yi-Chao Weng

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  • Hsinchu, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer electroplating apparatus
    • Patent number 7,449,091
    • Issue date Nov 11, 2008
    • Industrial Technology Research Institute
    • Chen-Chung Du
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Compress and position apparatus
    • Patent number 7,021,208
    • Issue date Apr 4, 2006
    • Industrial Technology Research Institute
    • Chen-Chung Du
    • B30 - PRESSES

Patents Applicationslast 30 patents

  • Information Patent Application

    Wafer electroplating apparatus
    • Publication number 20060137974
    • Publication date Jun 29, 2006
    • Chen-Chung Du
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Compress and position apparatus
    • Publication number 20050051023
    • Publication date Mar 10, 2005
    • Chen-Chung Du
    • B30 - PRESSES