Yi-Chieh Huang

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Tainan, TW

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Patents Grantslast 30 patents

Information Patent Grant
Bond wave optimization method and device
- Patent number 12,162,749
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Water bottle cap
- Patent number 12,084,233
- Issue date Sep 10, 2024
- Chen Whua International Co., Ltd.
- Yi-Jen Huang
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Bond wave optimization method and device
- Patent number 11,834,332
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
WATER BOTTLE CAP
- Publication number 20240174413
- Publication date May 30, 2024
- CHEN WHUA INTERNATIONAL CO., LTD.
- YI-JEN HUANG
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Bond Wave Optimization Method and Device
- Publication number 20230382723
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED DIELECTRIC FILM STRUCTURE AND ME...
- Publication number 20230278073
- Publication date Sep 7, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Kang-Yi Lien
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
BOND WAVE OPTIMIZATION METHOD AND DEVICE
- Publication number 20230043571
- Publication date Feb 9, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20230036136
- Publication date Feb 2, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY