YI-CHUAN TENG

Person

HSINCHU COUNTY, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated heater (and related method) to recover degraded piezoele...
- Patent number 12,082,505
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Alexander Kalnitsky
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,074,110
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching-Kai Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level device measurement for optical sensors
- Patent number 12,062,585
- Issue date Aug 13, 2024
- Artilux, Inc.
- Chien-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with movable membrane
- Patent number 12,043,538
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chuan Teng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,017,908
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching-Kai Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dual micro-electro mechanical system and manufacturing method thereof
- Patent number 11,993,512
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang-Che Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integration scheme for breakdown voltage enhancement of a piezoelec...
- Patent number 11,984,261
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Anderson Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS device and method for making the same
- Patent number 11,851,318
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chuan Teng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and method for manufacturing thereof
- Patent number 11,807,520
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi-Chuan Teng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming dielectric and metal sealing layers on capping st...
- Patent number 11,772,960
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching-Kai Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated heater (and related method) to recover degraded piezoele...
- Patent number 11,730,058
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Alexander Kalnitsky
Information Patent Grant
MEMS device and manufacturing method thereof
- Patent number 11,516,596
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wei-Chu Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Layer for buffer semiconductor device including microelectromechnic...
- Patent number 11,462,478
- Issue date Oct 4, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching-Kai Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for fabricating the same
- Patent number 11,434,129
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming semiconductor device structure
- Patent number 11,292,712
- Issue date Apr 5, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Chuan Teng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reduction of electric field enhanced moisture penetration by metal...
- Patent number 11,289,568
- Issue date Mar 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yuan Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual micro-electro mechanical system and manufacturing method thereof
- Patent number 11,274,037
- Issue date Mar 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yang-Che Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 11,276,670
- Issue date Mar 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS devices including MEMS dies and connectors thereto
- Patent number 11,117,796
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integration scheme for breakdown voltage enhancement of a piezoelec...
- Patent number 11,107,630
- Issue date Aug 31, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Anderson Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method for the same
- Patent number 10,961,114
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching-Kai Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device including a capacitor
- Patent number 10,861,929
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Fung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices including MEMS dies and connectors thereto
- Patent number 10,710,871
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structure and formation method of semiconductor device structure
- Patent number 10,526,196
- Issue date Jan 7, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Chuan Teng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices including MEMS dies and connectors thereto
- Patent number 10,508,023
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vacuum sealed MEMS and CMOS package
- Patent number 10,155,659
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices including MEMS dies and connectors thereto
- Patent number 9,919,914
- Issue date Mar 20, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vacuum sealed MEMS and CMOS package
- Patent number 9,776,856
- Issue date Oct 3, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for a wafer seal ring
- Patent number 9,673,169
- Issue date Jun 6, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS-MEMS device structure, bonding mesa structure and associated m...
- Patent number 9,656,852
- Issue date May 23, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MOVABLE MEMBRANE
- Publication number 20240343551
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chuan TENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATION SCHEME FOR BREAKDOWN VOLTAGE ENHANCEMENT OF A PIEZOELEC...
- Publication number 20240290541
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Anderson Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20240286889
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHING-KAI SHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20240262681
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20230382718
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- YI-CHUAN TENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20230382719
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHING-KAI SHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer-Level Device Measurement for Optical Sensors
- Publication number 20230120504
- Publication date Apr 20, 2023
- Artilux, Inc.
- Chien-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20220411260
- Publication date Dec 29, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- YI-CHUAN TENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED HEATER (AND RELATED METHOD) TO RECOVER DEGRADED PIEZOELE...
- Publication number 20220384709
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alexander Kalnitsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220367378
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- CHING-KAI SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20220340407
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chuan TENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20220340408
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- CHING-KAI SHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20220315414
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEN CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MOVABLE MEMBRANE AND METHOD FOR...
- Publication number 20220227618
- Publication date Jul 21, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chuan TENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20220194783
- Publication date Jun 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220141596
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-CHU LIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATION SCHEME FOR BREAKDOWN VOLTAGE ENHANCEMENT OF A PIEZOELEC...
- Publication number 20210383972
- Publication date Dec 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Anderson Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20210327852
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Chuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20210206627
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHING-KAI SHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20210130167
- Publication date May 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Che CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20200377362
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHING-KAI SHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200381366
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHING-KAI SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS DEVICES INCLUDING MEMS DIES AND CONNECTORS THERETO
- Publication number 20200339412
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20200140259
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Chuan Teng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
NOVEL INTEGRATION SCHEME FOR BREAKDOWN VOLTAGE ENHANCEMENT OF A PIE...
- Publication number 20200098517
- Publication date Mar 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Anderson Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HEATER (AND RELATED METHOD) TO RECOVER DEGRADED PIEZOELE...
- Publication number 20200098969
- Publication date Mar 26, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Alexander Kalnitsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS Devices Including MEMS Dies and Connectors Thereto
- Publication number 20200024129
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REDUCTION OF ELECTRIC FIELD ENHANCED MOISTURE PENETRATION BY METAL...
- Publication number 20200006469
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chi-Yuan Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING A CAPACITOR
- Publication number 20200006470
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Fung CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20190135610
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Chuan Teng
- B81 - MICRO-STRUCTURAL TECHNOLOGY

YI-CHUAN TENG

Person

Patents Grantslast 30 patents

Integrated heater (and related method) to recover degraded piezoele...

Method for manufacturing semiconductor device

Wafer-level device measurement for optical sensors

Semiconductor device structure with movable membrane

Semiconductor structure and method for forming the same

Dual micro-electro mechanical system and manufacturing method thereof

Integration scheme for breakdown voltage enhancement of a piezoelec...

MEMS device and method for making the same

Semiconductor structure and method for manufacturing thereof

Method of forming dielectric and metal sealing layers on capping st...

Integrated heater (and related method) to recover degraded piezoele...

MEMS device and manufacturing method thereof

Layer for buffer semiconductor device including microelectromechnic...

Semiconductor structure and method for fabricating the same

Method of forming semiconductor device structure

Reduction of electric field enhanced moisture penetration by metal...

Dual micro-electro mechanical system and manufacturing method thereof

Semiconductor device and manufacturing method of semiconductor device

MEMS devices including MEMS dies and connectors thereto

Integration scheme for breakdown voltage enhancement of a piezoelec...

Semiconductor structure and manufacturing method for the same

Electronic device including a capacitor

MEMS devices including MEMS dies and connectors thereto

Structure and formation method of semiconductor device structure

MEMS devices including MEMS dies and connectors thereto

Vacuum sealed MEMS and CMOS package

MEMS devices including MEMS dies and connectors thereto

Vacuum sealed MEMS and CMOS package

Method and apparatus for a wafer seal ring

CMOS-MEMS device structure, bonding mesa structure and associated m...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE STRUCTURE WITH MOVABLE MEMBRANE

INTEGRATION SCHEME FOR BREAKDOWN VOLTAGE ENHANCEMENT OF A PIEZOELEC...

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

Wafer-Level Device Measurement for Optical Sensors

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THEREOF

INTEGRATED HEATER (AND RELATED METHOD) TO RECOVER DEGRADED PIEZOELE...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

MEMS DEVICE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE WITH MOVABLE MEMBRANE AND METHOD FOR...

DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

MEMS DEVICE AND MANUFACTURING METHOD THEREOF

INTEGRATION SCHEME FOR BREAKDOWN VOLTAGE ENHANCEMENT OF A PIEZOELEC...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

MEMS DEVICES INCLUDING MEMS DIES AND CONNECTORS THERETO

METHOD OF FORMING SEMICONDUCTOR DEVICE STRUCTURE

NOVEL INTEGRATION SCHEME FOR BREAKDOWN VOLTAGE ENHANCEMENT OF A PIE...

INTEGRATED HEATER (AND RELATED METHOD) TO RECOVER DEGRADED PIEZOELE...

MEMS Devices Including MEMS Dies and Connectors Thereto

REDUCTION OF ELECTRIC FIELD ENHANCED MOISTURE PENETRATION BY METAL...

ELECTRONIC DEVICE INCLUDING A CAPACITOR

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE