Yi-chun Wu

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Miaoli County, TW

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Patents Grantslast 30 patents

Information Patent Grant
High heat dissipation stacked chip package structure and the manufa...
- Patent number 10,014,283
- Issue date Jul 3, 2018
- Jing Qiao Corporation Limited
- Chin-Liang Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor construction, semiconductor unit, and manufacturing m...
- Patent number 9,209,371
- Issue date Dec 8, 2015
- Unistars
- Tien-hao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED packaging construction and manufacturing method thereof
- Patent number 9,059,384
- Issue date Jun 16, 2015
- Unistars
- Shin-Shien Shie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, semiconductor construction, and manufacturing method the...
- Patent number 8,866,313
- Issue date Oct 21, 2014
- Unistars Corporation
- Tien-Hao Huang
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
Substrate, Semiconductor Construction, and Manufacturing Method The...
- Publication number 20140191274
- Publication date Jul 10, 2014
- Unistars Corporation
- Tien-Hao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Construction, Semiconductor Unit, and Manufacturing M...
- Publication number 20140151741
- Publication date Jun 5, 2014
- Unistars
- Tien-hao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED Packaging Construction and Manufacturing Method Thereof
- Publication number 20140151730
- Publication date Jun 5, 2014
- Unistars
- Shin-Shien Shie
- H01 - BASIC ELECTRIC ELEMENTS