Yi Eok KWON

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Suwon-si, KR

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Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
- Publication number 20240258274
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- Sangkyu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240213113
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Yi Eok Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20190229070
- Publication date Jul 25, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Yi Eok KWON
- H01 - BASIC ELECTRIC ELEMENTS