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Taipei Hsien, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Method for making damascene interconnect with bilayer capping film
Patent number
6,960,522
Issue date
Nov 1, 2005
United Microelectronics Corp.
Jei-Ming Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Damascene interconnect with bi-layer capping film
Patent number
6,873,057
Issue date
Mar 29, 2005
United Microelectrtonics Corp.
Jei-Ming Chen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
METHOD FOR MAKING DAMASCENE INTERCONNECT WITH BILAYER CAPPING FILM
Publication number
20040166674
Publication date
Aug 26, 2004
Jei-Ming Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DAMASCENE INTERCONNECT WITH BILAYER CAPPING FILM
Publication number
20040161924
Publication date
Aug 19, 2004
Jei-Ming Chen
H01 - BASIC ELECTRIC ELEMENTS