TREA

Yi-Hsiang Pan

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  • Feng-Shan City, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Heat dissipation module for a BGA IC
    • Patent number 6,486,564
    • Issue date Nov 26, 2002
    • Walsin Advanced Electronics Ltd.
    • Wen-Chun Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Lead frame structure
    • Patent number 6,204,553
    • Issue date Mar 20, 2001
    • Walsin Advanced Electronics Ltd.
    • Wen-Chun Liu
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents