Yi-Hsin Pao

Person

Livonia, MI, US

People

Patents Grantslast 30 patents

Information Patent Grant
Plastic encapsulated IC package and method of designing same
- Patent number 6,187,601
- Issue date Feb 13, 2001
- Ford Global Technologies, Inc.
- Jun Min Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimized solder joints and lifter pads for improving the solder jo...
- Patent number 5,936,846
- Issue date Aug 10, 1999
- Ford Global Technologies
- Vivek Amir Jairazbhoy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Standoff controlled interconnection
- Patent number 5,931,371
- Issue date Aug 3, 1999
- Ford Motor Company
- Yi-Hsin Pao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Meniscus-shape terminations for leadless electronic components
- Patent number 5,813,884
- Issue date Sep 29, 1998
- Ford Global Technologies, Inc.
- Yi-Hsin Pao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic encapsulated IC package and method of designing same
- Patent number 5,773,877
- Issue date Jun 30, 1998
- Ford Motor Company
- Jun Min Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with silicon dice oriented for improved reliability
- Patent number 5,736,786
- Issue date Apr 7, 1998
- Ford Global Technologies, Inc.
- Venkateswara A. Sankaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double surface mount technology for electronic packaging
- Patent number 5,386,343
- Issue date Jan 31, 1995
- Ford Motor Company
- Yi-Hsin Pao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Yi-Hsin Pao

Person

Patents Grantslast 30 patents

Plastic encapsulated IC package and method of designing same

Optimized solder joints and lifter pads for improving the solder jo...

Standoff controlled interconnection

Meniscus-shape terminations for leadless electronic components

Plastic encapsulated IC package and method of designing same

Power module with silicon dice oriented for improved reliability

Double surface mount technology for electronic packaging