Yi Hsiu Liu

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Kaohsiung City, CN

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Patents Grantslast 30 patents

Information Patent Grant
Die-die stacking structure and method for making the same
- Patent number 9,214,438
- Issue date Dec 15, 2015
- Advanced Micro Devices (Shanghai) Co., Ltd.
- I-Tseng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-die stacking structure and method for making the same
- Patent number 8,994,191
- Issue date Mar 31, 2015
- Advanced Micro Devices (Shanghai) Co. Ltd.
- I-Tseng Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE-DIE STACKING STRUCTURE AND METHOD FOR MAKING THE SAME
- Publication number 20150171043
- Publication date Jun 18, 2015
- ADVANCED MICRO DEVICES (SHANGHAI) CO. LTD
- I-Tseng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-DIE STACKING STRUCTURE AND METHOD FOR MAKING THE SAME
- Publication number 20140306338
- Publication date Oct 16, 2014
- I-Tseng Lee
- H01 - BASIC ELECTRIC ELEMENTS