Yi-Jung LIU

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Milpitas, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming package structure
- Patent number 11,951,571
- Issue date Apr 9, 2024
- Integrated Silicon Solution Inc.
- Cheng-Fu Yu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming package structure
- Patent number 11,612,965
- Issue date Mar 28, 2023
- Integrated Silicon Solution Inc.
- Cheng-Fu Yu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20230173615
- Publication date Jun 8, 2023
- Integrated Silicon Solution Inc.
- Cheng-Fu YU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20210305136
- Publication date Sep 30, 2021
- Integrated Silicon Solution Inc.
- Cheng-Fu YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20210299791
- Publication date Sep 30, 2021
- Integrated Silicon Solution Inc.
- Cheng-Fu YU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR