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Patents Grantslast 30 patents

Information Patent Grant
Bond head cooling apparatus
- Patent number 10,622,329
- Issue date Apr 14, 2020
- ASM Technology Singapore Pte. Ltd.
- Yi Kei Law
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Atomization mechanism for cooling a bond head
- Patent number 10,312,214
- Issue date Jun 4, 2019
- ASM Technology Singapore Pte. Ltd.
- Yi Kei Law
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ATOMIZATION MECHANISM FOR COOLING A BOND HEAD
- Publication number 20180068973
- Publication date Mar 8, 2018
- ASM Technology Singapore Pte Ltd
- Yi Kei LAW
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
BOND HEAD COOLING APPARATUS
- Publication number 20160116217
- Publication date Apr 28, 2016
- Yi Kei LAW
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...