Yi Koan HONG

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including through via, semiconductor package,...
- Patent number 12,107,109
- Issue date Oct 1, 2024
- Samsung Electronics Co., Ltd.
- Yi Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including through vias and methods of fabrica...
- Patent number 11,791,211
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Yi Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through via, semiconductor package,...
- Patent number 11,626,443
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Yi Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including through vias and methods of fabrica...
- Patent number 11,295,981
- Issue date Apr 5, 2022
- Samsung Electronics Co., Ltd.
- Yi Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 10,978,655
- Issue date Apr 13, 2021
- Samsung Electronics Co., Ltd.
- Yi-Koan Hong
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device including through via, semiconductor package,...
- Patent number 10,734,430
- Issue date Aug 4, 2020
- Samsung Electronics Co., Ltd.
- Yi Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 10,446,774
- Issue date Oct 15, 2019
- Samsung Electronics Co., Ltd.
- Yi-Koan Hong
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of fabricating multi-substrate semiconductor devices
- Patent number 9,865,581
- Issue date Jan 9, 2018
- Samsung Electronics Co., Ltd.
- Joo-Hee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a semiconductor device
- Patent number 9,653,623
- Issue date May 16, 2017
- Samsung Electronics Co., Ltd.
- Yi-Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having hybrid stacking structures and methods...
- Patent number 9,530,706
- Issue date Dec 27, 2016
- Samsung Electronics Co., Ltd.
- Pil-Kyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer loaders having buffer zones
- Patent number 9,502,274
- Issue date Nov 22, 2016
- Samsung Electronics Co., Ltd.
- Yi Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having metal patterns and piezoelectric patterns
- Patent number 9,431,341
- Issue date Aug 30, 2016
- Samsung Electronics Co., Ltd.
- Yi-Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a conductive structure including oxide...
- Patent number 8,575,753
- Issue date Nov 5, 2013
- Samsung Electronics Co., Ltd.
- Suk-hun Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA, SEMICONDUCTOR PACKAGE,...
- Publication number 20230230995
- Publication date Jul 20, 2023
- Samsung Electronics Co., Ltd.
- Yi Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING THROUGH VIAS AND METHODS OF FABRICA...
- Publication number 20220199469
- Publication date Jun 23, 2022
- Samsung Electronics Co., Ltd.
- YI KOAN HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING THROUGH VIAS AND METHODS OF FABRICA...
- Publication number 20200381301
- Publication date Dec 3, 2020
- Samsung Electronics Co., Ltd.
- YI KOAN HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA, SEMICONDUCTOR PACKAGE,...
- Publication number 20200343291
- Publication date Oct 29, 2020
- Samsung Electronics Co., Ltd.
- Yi Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20200006269
- Publication date Jan 2, 2020
- Samsung Electronics Co., Ltd.
- Yi-Koan HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA, SEMICONDUCTOR PACKAGE,...
- Publication number 20190386051
- Publication date Dec 19, 2019
- Samsung Electronics Co., Ltd.
- Yi Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20180366671
- Publication date Dec 20, 2018
- Samsung Electronics Co., Ltd.
- Yi-Koan HONG
- B82 - NANO-TECHNOLOGY
Information Patent Application
METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20160155862
- Publication date Jun 2, 2016
- Samsung Electronics Co., Ltd.
- Yi-Koan HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING MULTI-SUBSTRATE SEMICONDUCTOR DEVICES
- Publication number 20160141282
- Publication date May 19, 2016
- Samsung Electronics Co., Ltd.
- Joo-Hee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING HYBRID STACKING STRUCTURES AND METHODS...
- Publication number 20150279825
- Publication date Oct 1, 2015
- Pil-Kyu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING METAL PATTERNS AND PIEZOELECTRIC PATTERNS
- Publication number 20150137325
- Publication date May 21, 2015
- Samsung Electronics Co., Ltd.
- Yi-Koan HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LOADERS HAVING BUFFER ZONES
- Publication number 20150068948
- Publication date Mar 12, 2015
- Samsung Electronics Co., Ltd.
- Yi Koan HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING PLANARIZED INSULATION LAYERS AND METHO...
- Publication number 20120214316
- Publication date Aug 23, 2012
- Jin-Woo Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A CONDUCTIVE STRUCTURE
- Publication number 20100301480
- Publication date Dec 2, 2010
- SUK-HUN CHOI
- H01 - BASIC ELECTRIC ELEMENTS

Yi Koan HONG

Person

Patents Grantslast 30 patents

Semiconductor device including through via, semiconductor package,...

Semiconductor devices including through vias and methods of fabrica...

Semiconductor device including through via, semiconductor package,...

Semiconductor devices including through vias and methods of fabrica...

Semiconductor devices

Semiconductor device including through via, semiconductor package,...

Semiconductor devices

Method of fabricating multi-substrate semiconductor devices

Methods of manufacturing a semiconductor device

Semiconductor devices having hybrid stacking structures and methods...

Wafer loaders having buffer zones

Semiconductor device having metal patterns and piezoelectric patterns

Semiconductor device having a conductive structure including oxide...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA, SEMICONDUCTOR PACKAGE,...

SEMICONDUCTOR DEVICES INCLUDING THROUGH VIAS AND METHODS OF FABRICA...

SEMICONDUCTOR DEVICES INCLUDING THROUGH VIAS AND METHODS OF FABRICA...

SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA, SEMICONDUCTOR PACKAGE,...

SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA, SEMICONDUCTOR PACKAGE,...

SEMICONDUCTOR DEVICES

METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE

METHOD OF FABRICATING MULTI-SUBSTRATE SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICES HAVING HYBRID STACKING STRUCTURES AND METHODS...

SEMICONDUCTOR DEVICE HAVING METAL PATTERNS AND PIEZOELECTRIC PATTERNS

WAFER LOADERS HAVING BUFFER ZONES

SEMICONDUCTOR DEVICES HAVING PLANARIZED INSULATION LAYERS AND METHO...

SEMICONDUCTOR DEVICE HAVING A CONDUCTIVE STRUCTURE