Yi Lin

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Encapsulation process for double-sided cooled packages
- Patent number 11,955,347
- Issue date Apr 9, 2024
- ASMPT SINGAPORE PTE. LTD.
- Teng Hock Kuah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of memory device
- Patent number 11,723,295
- Issue date Aug 8, 2023
- United Microelectronics Corp.
- Hai Tao Liu
Information Patent Grant
Dual-sided molding for encapsulating electronic devices
- Patent number 11,621,181
- Issue date Apr 4, 2023
- ASMPT SINGAPORE PTE. LTD.
- Teng Hock Kuah
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Structure of memory device and fabrication method thereof
- Patent number 11,239,419
- Issue date Feb 1, 2022
- United Microelectronics Corp.
- Hai Tao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for molding a semiconductor device
- Patent number 7,241,414
- Issue date Jul 10, 2007
- ASM Technology Singapore Pte. Ltd.
- Shu C Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDING APPARATUS HAVING WEDGE DRIVER
- Publication number 20240262019
- Publication date Aug 8, 2024
- ASMPT SINGAPORE PTE. LTD
- Teng Hock KUAH
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
APPARATUS FOR APPLYING A SINTERING FORCE VIA A COMPRESSIBLE FILM
- Publication number 20240030181
- Publication date Jan 25, 2024
- ASMPT SINGAPORE PTE. LTD
- Jiapei DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATION PROCESS FOR DOUBLE-SIDED COOLED PACKAGES
- Publication number 20230178382
- Publication date Jun 8, 2023
- ASMPT SINGAPORE PTE. LTD
- Teng Hock KUAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF MEMORY DEVICE
- Publication number 20220109104
- Publication date Apr 7, 2022
- United Microelectronics Corp.
- HAI TAO LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED MOLDING FOR ENCAPSULATING ELECTRONIC DEVICES
- Publication number 20210351049
- Publication date Nov 11, 2021
- ASM Technology Singapore Pte Ltd
- Teng Hock KUAH
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
STRUCTURE OF MEMORY DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20200388759
- Publication date Dec 10, 2020
- United Microelectronics Corp.
- HAI TAO LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for molding a semiconductor device
- Publication number 20050287236
- Publication date Dec 29, 2005
- ASM Technology Singapore Pte Ltd
- Shu Chuen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device with high lead density
- Publication number 20050248041
- Publication date Nov 10, 2005
- ATM Technology Singapore Pte Ltd
- Teng Hock Kuah
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Encapsulation process for double-sided cooled packages

Fabrication method of memory device

Dual-sided molding for encapsulating electronic devices

Structure of memory device and fabrication method thereof

Method and apparatus for molding a semiconductor device

Patents Applicationslast 30 patents

MOLDING APPARATUS HAVING WEDGE DRIVER

APPARATUS FOR APPLYING A SINTERING FORCE VIA A COMPRESSIBLE FILM

ENCAPSULATION PROCESS FOR DOUBLE-SIDED COOLED PACKAGES

FABRICATION METHOD OF MEMORY DEVICE

DUAL-SIDED MOLDING FOR ENCAPSULATING ELECTRONIC DEVICES

STRUCTURE OF MEMORY DEVICE AND FABRICATION METHOD THEREOF

Method and apparatus for molding a semiconductor device

Electronic device with high lead density