Yi-Mang CHOU

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Zhubei City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Bond pad design for improved routing and reduced package stress
- Patent number 9,053,943
- Issue date Jun 9, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Mang Chou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING A BOND PAD DESIGN FOR IMPROVED ROUTING AND REDUCE...
- Publication number 20120329263
- Publication date Dec 27, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Mang CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD DESIGN FOR IMPROVED ROUTING AND REDUCED PACKAGE STRESS
- Publication number 20120326336
- Publication date Dec 27, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Mang CHOU
- H01 - BASIC ELECTRIC ELEMENTS