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Yi-Mang CHOU
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Zhubei City, TW
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Patents Grants
last 30 patents
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Patent Grant
Bond pad design for improved routing and reduced package stress
Patent number
9,053,943
Issue date
Jun 9, 2015
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-Mang Chou
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
METHOD OF FORMING A BOND PAD DESIGN FOR IMPROVED ROUTING AND REDUCE...
Publication number
20120329263
Publication date
Dec 27, 2012
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-Mang CHOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOND PAD DESIGN FOR IMPROVED ROUTING AND REDUCED PACKAGE STRESS
Publication number
20120326336
Publication date
Dec 27, 2012
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-Mang CHOU
H01 - BASIC ELECTRIC ELEMENTS