Yi Ming LIANG

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Shenzhen, CN

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Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE, PACKAGE FORMING METHOD, AND POWER SUPPLY MODULE
- Publication number 20240203843
- Publication date Jun 20, 2024
- Shenzhen STS Microelectronics Co., Ltd.
- Lin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD OF FORMING THE PACKAGE AND ELECTRONIC...
- Publication number 20230135498
- Publication date May 4, 2023
- STMicroelectronics S.r.l.
- Yi Ming LIANG
- H01 - BASIC ELECTRIC ELEMENTS