Yi Pan

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fabricating an integrated circuit chip module with stiffening frame...
- Patent number 10,892,170
- Issue date Jan 12, 2021
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a chip module with stiffening frame and ortho...
- Patent number 10,566,215
- Issue date Feb 18, 2020
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip module with stiffening frame and orthogonal heat spreader
- Patent number 10,424,494
- Issue date Sep 24, 2019
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a chip module with stiffening frame and direc...
- Patent number 10,090,173
- Issue date Oct 2, 2018
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing directional stress in an orthotropic encapsulation member...
- Patent number 9,583,408
- Issue date Feb 28, 2017
- International Business Machines Corporation
- Marcus E. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreading layer with high thermal conductivity
- Patent number 9,437,515
- Issue date Sep 6, 2016
- International Business Machines Corporation
- Evan G. Colgan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER
- Publication number 20180277396
- Publication date Sep 27, 2018
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER
- Publication number 20180061732
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER
- Publication number 20180061733
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING DIRECTIONAL STRESS IN AN ORTHOTROPIC ENCAPSULATION MEMBER...
- Publication number 20170053845
- Publication date Feb 23, 2017
- International Business Machines Corporation
- Marcus E. INTERRANTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER
- Publication number 20160358836
- Publication date Dec 8, 2016
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY
- Publication number 20150373879
- Publication date Dec 24, 2015
- International Business Machines Corporation
- Evan G. Colgan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY
- Publication number 20150371922
- Publication date Dec 24, 2015
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY
- Publication number 20150371917
- Publication date Dec 24, 2015
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY
- Publication number 20150371918
- Publication date Dec 24, 2015
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY
- Publication number 20150371919
- Publication date Dec 24, 2015
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY
- Publication number 20150373880
- Publication date Dec 24, 2015
- International Business Machines Corporation
- Evan G. Colgan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY
- Publication number 20140284040
- Publication date Sep 25, 2014
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Fabricating an integrated circuit chip module with stiffening frame...

Method of fabricating a chip module with stiffening frame and ortho...

Chip module with stiffening frame and orthogonal heat spreader

Method of fabricating a chip module with stiffening frame and direc...

Reducing directional stress in an orthotropic encapsulation member...

Heat spreading layer with high thermal conductivity

Patents Applicationslast 30 patents

CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER

CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER

CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER

REDUCING DIRECTIONAL STRESS IN AN ORTHOTROPIC ENCAPSULATION MEMBER...

CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER

HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY

HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY

HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY

HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY

HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY

HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY

HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY