TREA

Yi Pan

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  • Vancouver, WA, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method for lapping a wafer
    • Patent number 6,733,368
    • Issue date May 11, 2004
    • SEH America, Inc.
    • Yi Pan
    • B24 - GRINDING POLISHING

Patents Applicationslast 30 patents