Membership
Tour
Register
Log in
Yi Sheng Anthony SUN
Follow
Person
Singapore, SG
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Multi-chip ball grid array package and method of manufacture
Patent number
7,851,899
Issue date
Dec 14, 2010
UTAC - United Test and Assembly Test Center Ltd.
Fung Leng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cavity chip package
Patent number
7,339,278
Issue date
Mar 4, 2008
United Test & Assembly Center Ltd.
Henry Iksan
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTERPOSER FOR SEMICONDUCTOR PACKAGE
Publication number
20120104628
Publication date
May 3, 2012
United Test & Assembly Center Ltd.
Chin Hock Toh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF PACKAGING SEMICONDUCTOR DEVICES
Publication number
20100261313
Publication date
Oct 14, 2010
United Test & Assembly Center Ltd.
Chin Hock TOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING STRUCTURAL MEMBER
Publication number
20100013081
Publication date
Jan 21, 2010
United Test & Assembly Center Ltd.
Chin Hock TOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR STRUCTURE
Publication number
20090236726
Publication date
Sep 24, 2009
United Test & Assembly Center Ltd.
Danny RETUTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Structurally-enhanced integrated circuit package and method of manu...
Publication number
20090072391
Publication date
Mar 19, 2009
Ravi Kanth Kolan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH SILICON VIA DIES AND PACKAGES
Publication number
20080303163
Publication date
Dec 11, 2008
United Test & Assembly Center Ltd.
Hao LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-chip ball grid array package and method of manufacture
Publication number
20070158815
Publication date
Jul 12, 2007
Fung Leng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CAVITY CHIP PACKAGE
Publication number
20070069371
Publication date
Mar 29, 2007
United Test & Assembly Center Ltd.
Henry IKSAN
H01 - BASIC ELECTRIC ELEMENTS