Yi-Sing Hsiao

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device structure with metal gate stacks
- Patent number 12,166,105
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hsuan Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for detecting biomolecules
- Patent number 12,090,477
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi-Hsing Hsiao
- G01 - MEASURING TESTING
Information Patent Grant
Gas sensing device and detecting system
- Patent number 12,050,192
- Issue date Jul 30, 2024
- National Tsing Hua University
- Nyan-Hwa Tai
- G01 - MEASURING TESTING
Information Patent Grant
Method for forming a semiconductor component with a cooling structure
- Patent number 12,027,446
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method of package components and bonding apparatus
- Patent number 11,955,378
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Biosensor
- Patent number 11,940,412
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Jie Huang
- B03 - SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES O...
Information Patent Grant
Discrete time loop based thermal control
- Patent number 11,934,239
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui-Cheng Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Residue-free metal gate cutting for fin-like field effect transistor
- Patent number 11,915,980
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ya-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensing device and optical sensing system thereof comprisin...
- Patent number 11,894,481
- Issue date Feb 6, 2024
- Epistar Corporation
- Yi-Chieh Lin
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method and system for packet processing according to access control...
- Patent number 11,882,121
- Issue date Jan 23, 2024
- OPTICORE TECHNOLOGIES, INC.
- Yi-Lung Hsiao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit with biofets and fabrication thereof
- Patent number 11,860,120
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tung-Tsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with BioFETs
- Patent number 11,860,121
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tung-Tsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure cutting process and structures formed thereby
- Patent number 11,855,085
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with metal gate stacks
- Patent number 11,830,926
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hsuan Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having doped work function metal layer
- Patent number 11,791,338
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hsiung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with cutting depth control and method for f...
- Patent number 11,721,588
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packet processing according to a table lookup
- Patent number 11,711,305
- Issue date Jul 25, 2023
- Yi-Lung Hsiao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Biosensor
- Patent number 11,686,704
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Jie Huang
- B03 - SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES O...
Information Patent Grant
Biosensors, method for forming the same, and method of operating th...
- Patent number 11,668,671
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi-Hsing Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for size estimation by image recognition of specific target...
- Patent number 11,580,659
- Issue date Feb 14, 2023
- National Applied Research Laboratories
- Jyh-Horng Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Residue-free metal gate cutting for fin-like field effect transistor
- Patent number 11,527,443
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ya-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with cooling structure
- Patent number 11,515,233
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for binary search
- Patent number 11,449,275
- Issue date Sep 20, 2022
- OPTICORE TECHNOLOGIES INC. (US)
- Yi-Lung Hsiao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonding method of package components and bonding apparatus
- Patent number 11,443,981
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure cutting process and structures formed thereby
- Patent number 11,444,080
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and bump formation process
- Patent number 11,348,889
- Issue date May 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding with pre-deoxide process and apparatus for performing the same
- Patent number 11,342,302
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,244,945
- Issue date Feb 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hsiung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having a bridge layer
- Patent number 11,227,975
- Issue date Jan 18, 2022
- Epistar Corporation
- Yung-Fu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and package structure
- Patent number 11,227,978
- Issue date Jan 18, 2022
- Epistar Corporation
- Wen-Luh Liao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR DETECTING BIOMOLECULES
- Publication number 20240367166
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YI-HSING HSIAO
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
APPARATUS INCLUDING COOLING STRUCTURE
- Publication number 20240312872
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE TIME LOOP BASED THERMAL CONTROL
- Publication number 20240192744
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Jui-Cheng HUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RESIDUE-FREE METAL GATE CUTTING FOR FIN-LIKE FIELD EFFECT TRANSISTOR
- Publication number 20240194534
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Ya-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSING DEVICE AND OPTICAL SENSING SYSTEM THEREOF
- Publication number 20240136463
- Publication date Apr 25, 2024
- EPISTAR CORPORATION
- Yi-Chieh LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20240113113
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH BIOFETS
- Publication number 20240102959
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Tsun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR DETERMINING CHARACTERISTIC CELLS BASED ON IMA...
- Publication number 20240062563
- Publication date Feb 22, 2024
- V5 TECHNOLOGIES CO., LTD.
- TZU-KUEI SHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BIOSENSOR
- Publication number 20240044837
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Jie Huang
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH METAL GATE STACKS
- Publication number 20240047557
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Hsuan HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING DOPED WORK FUNCTION METAL LAYER
- Publication number 20230369331
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsiung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH CUTTING DEPTH CONTROL AND METHOD FOR F...
- Publication number 20230335442
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chang HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR COMPONENT INCLUDING THE SAME
- Publication number 20230129560
- Publication date Apr 27, 2023
- EPISTAR CORPORATION
- Yao-Ru CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Residue-Free Metal Gate Cutting For Fin-Like Field Effect Transistor
- Publication number 20230105271
- Publication date Apr 6, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Ya-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR COMPONENT WITH A COOLING STRUCTURE
- Publication number 20230076466
- Publication date Mar 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR BIOSENSOR
- Publication number 20220390412
- Publication date Dec 8, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- YI-HSING HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIOSENSOR
- Publication number 20220381733
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Jie Huang
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT WITH BIOFETS
- Publication number 20220381729
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Tsun CHEN
- G01 - MEASURING TESTING
Information Patent Application
BONDING METHOD OF PACKAGE COMPONENTS AND BONDING APPARATUS
- Publication number 20220367255
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20220359510
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding with Pre-Deoxide Process and Apparatus for Performing the Same
- Publication number 20220285310
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR DETECTING BIOMOLECULES
- Publication number 20220280935
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- YI-HSING HSIAO
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
BIOSENSOR
- Publication number 20220252543
- Publication date Aug 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Jie Huang
- B03 - SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES O...
Information Patent Application
SEMICONDUCTOR DEVICE HAVING DOPED WORK FUNCTION METAL LAYER
- Publication number 20220149041
- Publication date May 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsiung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS SENSING DEVICE AND DETECTING SYSTEM
- Publication number 20220128503
- Publication date Apr 28, 2022
- National Tsing-Hua University
- Nyan-Hwa TAI
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH METAL GATE STACKS
- Publication number 20220102532
- Publication date Mar 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Hsuan HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20220102582
- Publication date Mar 31, 2022
- EPISTAR CORPORATION
- Yung-Fu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE TIME LOOP BASED THERMAL CONTROL
- Publication number 20220091646
- Publication date Mar 24, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Jui-Cheng HUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT WITH BIOFETS AND FABRICATION THEREOF
- Publication number 20220065812
- Publication date Mar 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Tsun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSING DEVICE AND OPTICAL SENSING SYSTEM THEREOF
- Publication number 20220059717
- Publication date Feb 24, 2022
- EPISTAR CORPORATION
- Yi-Chieh LIN
- G01 - MEASURING TESTING

Yi-Sing Hsiao

Person

Patents Grantslast 30 patents

Semiconductor device structure with metal gate stacks

System and method for detecting biomolecules

Gas sensing device and detecting system

Method for forming a semiconductor component with a cooling structure

Bonding method of package components and bonding apparatus

Biosensor

Discrete time loop based thermal control

Residue-free metal gate cutting for fin-like field effect transistor

Optical sensing device and optical sensing system thereof comprisin...

Method and system for packet processing according to access control...

Integrated circuit with biofets and fabrication thereof

Integrated circuit with BioFETs

Semiconductor structure cutting process and structures formed thereby

Semiconductor device structure with metal gate stacks

Semiconductor device having doped work function metal layer

Semiconductor structure with cutting depth control and method for f...

Method and system for packet processing according to a table lookup

Biosensor

Biosensors, method for forming the same, and method of operating th...

Method for size estimation by image recognition of specific target...

Residue-free metal gate cutting for fin-like field effect transistor

Semiconductor component with cooling structure

Method and system for binary search

Bonding method of package components and bonding apparatus

Semiconductor structure cutting process and structures formed thereby

Semiconductor device and bump formation process

Bonding with pre-deoxide process and apparatus for performing the same

Semiconductor device and manufacturing method thereof

Semiconductor structure having a bridge layer

Semiconductor device and package structure

Patents Applicationslast 30 patents

SYSTEM AND METHOD FOR DETECTING BIOMOLECULES

APPARATUS INCLUDING COOLING STRUCTURE

DISCRETE TIME LOOP BASED THERMAL CONTROL

RESIDUE-FREE METAL GATE CUTTING FOR FIN-LIKE FIELD EFFECT TRANSISTOR

OPTICAL SENSING DEVICE AND OPTICAL SENSING SYSTEM THEREOF

Semiconductor Structure Cutting Process and Structures Formed Thereby

INTEGRATED CIRCUIT WITH BIOFETS

SYSTEM AND METHOD FOR DETERMINING CHARACTERISTIC CELLS BASED ON IMA...

BIOSENSOR

SEMICONDUCTOR DEVICE STRUCTURE WITH METAL GATE STACKS

SEMICONDUCTOR DEVICE HAVING DOPED WORK FUNCTION METAL LAYER

SEMICONDUCTOR STRUCTURE WITH CUTTING DEPTH CONTROL AND METHOD FOR F...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR COMPONENT INCLUDING THE SAME

Residue-Free Metal Gate Cutting For Fin-Like Field Effect Transistor

METHOD FOR FORMING A SEMICONDUCTOR COMPONENT WITH A COOLING STRUCTURE

SEMICONDUCTOR BIOSENSOR

BIOSENSOR

INTEGRATED CIRCUIT WITH BIOFETS

BONDING METHOD OF PACKAGE COMPONENTS AND BONDING APPARATUS

Semiconductor Structure Cutting Process and Structures Formed Thereby

Bonding with Pre-Deoxide Process and Apparatus for Performing the Same

SYSTEM AND METHOD FOR DETECTING BIOMOLECULES

BIOSENSOR

SEMICONDUCTOR DEVICE HAVING DOPED WORK FUNCTION METAL LAYER

GAS SENSING DEVICE AND DETECTING SYSTEM

SEMICONDUCTOR DEVICE STRUCTURE WITH METAL GATE STACKS

SEMICONDUCTOR STRUCTURE

DISCRETE TIME LOOP BASED THERMAL CONTROL

INTEGRATED CIRCUIT WITH BIOFETS AND FABRICATION THEREOF

OPTICAL SENSING DEVICE AND OPTICAL SENSING SYSTEM THEREOF