Yi Su

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Reducing keep-out-zone area for a semiconductor device
- Patent number 12,021,060
- Issue date Jun 25, 2024
- Western Digital Technologies, Inc.
- Kevin Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged memory device with flip chip and wire bond dies
- Patent number 12,021,061
- Issue date Jun 25, 2024
- Western Digital Technologies, Inc.
- Rui Yuan
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
DATA PROCESSING SYSTEM, DATA PROCESSING METHOD, AND RELATED APPARATUS
- Publication number 20240223655
- Publication date Jul 4, 2024
- Huawei Technologies Co., Ltd
- Longwen LAN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method for Writing Data to Solid-State Drive
- Publication number 20240020014
- Publication date Jan 18, 2024
- Huawei Technologies Co., Ltd
- Wen Zhou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGED MEMORY DEVICE WITH FLIP CHIP AND WIRE BOND DIES
- Publication number 20220285316
- Publication date Sep 8, 2022
- Western Digital Technologies, Inc.
- Rui Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING KEEP-OUT-ZONE AREA FOR A SEMICONDUCTOR DEVICE
- Publication number 20220093559
- Publication date Mar 24, 2022
- Western Digital Technologies, Inc.
- Kevin Du
- H01 - BASIC ELECTRIC ELEMENTS