Yi Sun

Person

  • Singapore, SG

Patents Grantslast 30 patents

  • Information Patent Grant

    Packaging structural member

    • Patent number 9,704,726
    • Issue date Jul 11, 2017
    • UTAC HEADQUARTERS PTE. LTD.
    • Chin Hock Toh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Packaging structural member

    • Patent number 9,142,487
    • Issue date Sep 22, 2015
    • United Test & Assembly Center Ltd.
    • Chin Hock Toh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Interposer for semiconductor package

    • Patent number 8,772,921
    • Issue date Jul 8, 2014
    • United Test & Assembly Center Ltd.
    • Chin Hock Toh
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Through silicon via dies and packages

    • Patent number 8,741,762
    • Issue date Jun 3, 2014
    • United Test & Assembly Center Ltd.
    • Hao Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Through silicon via dies and packages

    • Patent number 8,586,465
    • Issue date Nov 19, 2013
    • United Test & Assembly Center Ltd.
    • Hao Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Packaging structural member

    • Patent number 8,384,203
    • Issue date Feb 26, 2013
    • United Test & Assembly Center Ltd.
    • Chin Hock Toh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Cell analysis using laser with external cavity

    • Patent number 7,767,444
    • Issue date Aug 3, 2010
    • Nanyang Technological University
    • Ai Qun Liu
    • G01 - MEASURING TESTING

Patents Applicationslast 30 patents

  • Information Patent Application

    PACKAGING STRUCTURAL MEMBER

    • Publication number 20160005629
    • Publication date Jan 7, 2016
    • UTAC Headquarters Pte. Ltd.
    • Chin Hock TOH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THROUGH SILICON VIA DIES AND PACKAGES

    • Publication number 20140045301
    • Publication date Feb 13, 2014
    • United Test & Assembly Center Ltd.
    • Hao LIU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGING STRUCTURAL MEMBER

    • Publication number 20130119560
    • Publication date May 16, 2013
    • United Test & Assembly Center Ltd.
    • Chin Hock TOH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Microfluidic Cell Sorter System

    • Publication number 20080213821
    • Publication date Sep 4, 2008
    • Nanyang Technological University
    • Ai Qun Liu
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    Cell analysis using laser with external cavity

    • Publication number 20060268260
    • Publication date Nov 30, 2006
    • Nanyang Technological University
    • Ai Qun Liu
    • G01 - MEASURING TESTING