TREA

Yi-Ting HU

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  • Budai Township, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Bonding apparatus and method
    • Patent number 10,312,118
    • Issue date Jun 4, 2019
    • Taiwan Semiconductor Manufacturing Co., Ltd
    • Pei-Shan Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Die stacking method
    • Patent number 10,083,950
    • Issue date Sep 25, 2018
    • Taiwan Semiconductor Manufacturing Co., Ltd
    • Larry Jann
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Die stacking apparatus and method
    • Patent number 9,536,814
    • Issue date Jan 3, 2017
    • Taiwan Semiconductor Manufacturing Co., Ltd
    • Larry Jann
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    DIE STACKING METHOD
    • Publication number 20170098639
    • Publication date Apr 6, 2017
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Larry JANN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIE STACKING APPARATUS AND METHOD
    • Publication number 20150243630
    • Publication date Aug 27, 2015
    • Taiwan Semiconductor Manufacturing Co., LTD
    • Larry JANN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING APPARATUS AND METHOD
    • Publication number 20150200118
    • Publication date Jul 16, 2015
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Pei-Shan WU
    • H01 - BASIC ELECTRIC ELEMENTS