YI WEI CHEN

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Hillsboro, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Vertical transistor using a through silicon via gate
- Patent number 10,505,034
- Issue date Dec 10, 2019
- Intel Corporation
- Xiaodong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip through-body-via capacitors and techniques for forming same
- Patent number 10,229,866
- Issue date Mar 12, 2019
- Intel Corporation
- Yi Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via based photovoltaic cell
- Patent number 10,158,034
- Issue date Dec 18, 2018
- Intel Corporation
- Kinyip Phoa
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
ON-CHIP THROUGH-BODY-VIA CAPACITORS AND TECHNIQUES FOR FORMING SAME
- Publication number 20180151474
- Publication date May 31, 2018
- Intel Corporation
- Yi Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL TRANSISTOR USING A THROUGH SILICON VIA GATE
- Publication number 20180130902
- Publication date May 10, 2018
- Intel Corporation
- Xiaodong YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA BASED PHOTOVOLTAIC CELL
- Publication number 20170155004
- Publication date Jun 1, 2017
- Intel Corporation
- KINYIP PHOA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER