Yi Xu

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Optoelectronic modules including optoelectronic device subassemblie...
- Patent number 10,510,932
- Issue date Dec 17, 2019
- ams Sensors Singapore Pte. Ltd.
- Hartmut Rudmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic device subassemblies and methods of manufacturing th...
- Patent number 10,243,111
- Issue date Mar 26, 2019
- ams Sensors Singapore Pte. Ltd.
- Hartmut Rudmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic modules that have shielding to reduce light leakage...
- Patent number 10,199,426
- Issue date Feb 5, 2019
- Heptagon Micro Optics Pte. Ltd.
- Hartmut Rudmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic modules that have shielding to reduce light leakage...
- Patent number 10,186,540
- Issue date Jan 22, 2019
- Heptagon Micro Optics Pte. Ltd.
- Hartmut Rudmann
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optoelectronic modules that have shielding to reduce light leakage...
- Patent number 9,859,327
- Issue date Jan 2, 2018
- Heptagon Micro Optics Pte. Ltd.
- Hartmut Rudmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic modules that have shielding to reduce light leakage...
- Patent number 9,543,354
- Issue date Jan 10, 2017
- Heptagon Micro Optics Pte. Ltd.
- Hartmut Rudmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic modules that have shielding to reduce light leakage...
- Patent number 9,094,593
- Issue date Jul 28, 2015
- Heptagon Micro Optics Pte. Ltd.
- Hartmut Rudmann
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method and apparatus for an algorithm development environment for s...
- Patent number 8,170,962
- Issue date May 1, 2012
- Singapore Technologies Dynamics PTE LTD
- Meng Hiot Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of copper/copper surface bonding using a conducting polymer...
- Patent number 7,452,808
- Issue date Nov 18, 2008
- Chartered Semiconductor Manufacturing Ltd.
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of copper/copper surface bonding using a conducting polymer...
- Patent number 7,060,613
- Issue date Jun 13, 2006
- Chartered Semiconductor Manufacturing Ltd.
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper diffusion deterrent interface
- Patent number 6,987,321
- Issue date Jan 17, 2006
- Chartered Semiconductor Manufacturing Ltd.
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of copper/copper surface bonding using a conducting polymer...
- Patent number 6,967,162
- Issue date Nov 22, 2005
- Chartered Semiconductor Manufacturing Ltd.
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods to clean copper contamination on wafer edge
- Patent number 6,813,796
- Issue date Nov 9, 2004
- Chartered Semiconductor
- Sudipto Ranendra Roy
- B08 - CLEANING
Information Patent Grant
Method of using silicon rich carbide as a barrier material for fluo...
- Patent number 6,730,591
- Issue date May 4, 2004
- Chartered Semiconductor Manufactoring Ltd.
- Licheng Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using hydrogen plasma to pre-clean copper surfaces during...
- Patent number 6,720,204
- Issue date Apr 13, 2004
- Chartered Semiconductor Manufacturing Ltd.
- John Leonard Sudijono
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of application of conductive cap-layer in flip-chip, cob, an...
- Patent number 6,705,512
- Issue date Mar 16, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Kwok Keung Paul Ho
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for cleaning semiconductor structures using hydrocarbon and...
- Patent number 6,692,579
- Issue date Feb 17, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Sudipto Ranendra Roy
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Damascene structure with reduced capacitance using a boron carbon n...
- Patent number 6,690,091
- Issue date Feb 10, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to create a copper diffusion deterrent interface
- Patent number 6,683,002
- Issue date Jan 27, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for removing contaminants from the perimeter o...
- Patent number 6,540,841
- Issue date Apr 1, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Sudipto Ranendra Roy
- B08 - CLEANING
Information Patent Grant
Method of manufacturing embedded organic stop layer for dual damasc...
- Patent number 6,475,810
- Issue date Nov 5, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Mei Sheng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low dielectric constant materials for copper damascene
- Patent number 6,436,824
- Issue date Aug 20, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to create copper traps by modifying treatment on the dielect...
- Patent number 6,429,117
- Issue date Aug 6, 2002
- Chartered Semiconductor Manufacturing Ltd.
- John Sudijono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using silicon rich carbide as a barrier material for fluo...
- Patent number 6,429,129
- Issue date Aug 6, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Licheng Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of boron carbide as an etch-stop and barrier layer for copper d...
- Patent number 6,424,044
- Issue date Jul 23, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Licheng M. Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of application of displacement reaction to form a conductive...
- Patent number 6,417,088
- Issue date Jul 9, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Kwok Keung Paul Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of application of copper solution in flip-chip, COB, and mic...
- Patent number 6,415,973
- Issue date Jul 9, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Kwok Keung Paul Ho
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low dielectric constant dielectric layer fabrication method employi...
- Patent number 6,395,631
- Issue date May 28, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to thin down copper barriers in deep submicron geometries by...
- Patent number 6,391,783
- Issue date May 21, 2002
- Chartered Semiconductor Manufacturing Ltd.
- John Sudijono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of application of conductive cap-layer in flip-chip, COB, an...
- Patent number 6,378,759
- Issue date Apr 30, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Kwok Keung Paul Ho
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
OPTOELECTRONIC MODULES INCLUDING OPTOELECTRONIC DEVICE SUBASSEMBLIE...
- Publication number 20190214533
- Publication date Jul 11, 2019
- ams Sensors Singapore Pte. Ltd.
- Hartmut Rudmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC MODULES THAT HAVE SHIELDING TO REDUCE LIGHT LEAKAGE...
- Publication number 20180102394
- Publication date Apr 12, 2018
- HEPTAGON MICRO OPTICS PTE. LTD.
- Hartmut Rudmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC MODULES INCLUDING OPTOELECTRONIC DEVICE SUBASSEMBLIE...
- Publication number 20180006192
- Publication date Jan 4, 2018
- HEPTAGON MICRO OPTICS PTE. LTD.
- Hartmut Rudmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC MODULES THAT HAVE SHIELDING TO REDUCE LIGHT LEAKAGE...
- Publication number 20170084663
- Publication date Mar 23, 2017
- HEPTAGON MICRO OPTICS PTE. LTD.
- Hartmut Rudmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC MODULES THAT HAVE SHIELDING TO REDUCE LIGHT LEAKAGE...
- Publication number 20150325613
- Publication date Nov 12, 2015
- HEPTAGON MICRO OPTICS PTE. LTD.
- Hartmut Rudmann
- G02 - OPTICS
Information Patent Application
OPTOELECTRONIC MODULES THAT HAVE SHIELDING TO REDUCE LIGHT LEAKAGE...
- Publication number 20150034975
- Publication date Feb 5, 2015
- HEPTAGON MICRO OPTICS PTE. LTD.
- Hartmut Rudmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC MODULES THAT HAVE SHIELDING TO REDUCE LIGHT LEAKAGE...
- Publication number 20150036046
- Publication date Feb 5, 2015
- HEPTAGON MICRO OPTICS PTE. LTD.
- Hartmut Rudmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for an Algorithm Development Environment for S...
- Publication number 20080313113
- Publication date Dec 18, 2008
- Singapore Technologies Dynamics Pte Ltd
- Meng Hiot Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method of copper/copper surface bonding using a conducting polymer...
- Publication number 20050112799
- Publication date May 26, 2005
- Chartered Semiconductor Manufacturing Ltd.
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of copper/copper surface bonding using a conducting polymer...
- Publication number 20050090102
- Publication date Apr 28, 2005
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of copper/copper surface bonding using a conducting polymer...
- Publication number 20050090039
- Publication date Apr 28, 2005
- Chartered Semiconductor Manufacturing Ltd.
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to create a copper diffusion deterrent interface
- Publication number 20040227247
- Publication date Nov 18, 2004
- CHARTERED SEMICONDUCTOR MANFACTURING LTD.
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method, system and mobile host for mobility pattern based selection...
- Publication number 20040141477
- Publication date Jul 22, 2004
- Institute for Infocomm Research
- Yi Xu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method of using hydrogen plasma to pre-clean copper surfaces during...
- Publication number 20030192943
- Publication date Oct 16, 2003
- Chartered Semiconductor Manufacturing Ltd.
- John Leonard Sudijono
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Apparatus and methods to clean copper contamination on wafer edge
- Publication number 20030140943
- Publication date Jul 31, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Sudipto Ranendra Roy
- B08 - CLEANING
Information Patent Application
Method of using silicon rich carbide as a barrier material for fluo...
- Publication number 20020164872
- Publication date Nov 7, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Licheng Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of application of conductive cap-layer in flip-chip, cob, an...
- Publication number 20020100794
- Publication date Aug 1, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Kwok Keung Paul Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for cleaning semiconductor structures using hydrocarbon and...
- Publication number 20020096190
- Publication date Jul 25, 2002
- Chartered Semiconductor Manufacturing Inc.
- Sudipto Ranendra Roy
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
Use of boron carbide as an etch-stop and barrier layer for copper d...
- Publication number 20020076918
- Publication date Jun 20, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Licheng M. Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Application of vapor phase HFACAC-based compound for use in copper...
- Publication number 20020048950
- Publication date Apr 25, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Yakub Aliyu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Gap filling process in integrated circuits using low dielectric con...
- Publication number 20010012687
- Publication date Aug 9, 2001
- Chartered Semiconductor Manufacturing Ltd.
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Optoelectronic modules including optoelectronic device subassemblie...

Optoelectronic device subassemblies and methods of manufacturing th...

Optoelectronic modules that have shielding to reduce light leakage...

Optoelectronic modules that have shielding to reduce light leakage...

Optoelectronic modules that have shielding to reduce light leakage...

Optoelectronic modules that have shielding to reduce light leakage...

Optoelectronic modules that have shielding to reduce light leakage...

Method and apparatus for an algorithm development environment for s...

Method of copper/copper surface bonding using a conducting polymer...

Method of copper/copper surface bonding using a conducting polymer...

Copper diffusion deterrent interface

Method of copper/copper surface bonding using a conducting polymer...

Apparatus and methods to clean copper contamination on wafer edge

Method of using silicon rich carbide as a barrier material for fluo...

Method of using hydrogen plasma to pre-clean copper surfaces during...

Method of application of conductive cap-layer in flip-chip, cob, an...

Method for cleaning semiconductor structures using hydrocarbon and...

Damascene structure with reduced capacitance using a boron carbon n...

Method to create a copper diffusion deterrent interface

Method and apparatus for removing contaminants from the perimeter o...

Method of manufacturing embedded organic stop layer for dual damasc...

Low dielectric constant materials for copper damascene

Method to create copper traps by modifying treatment on the dielect...

Method of using silicon rich carbide as a barrier material for fluo...

Use of boron carbide as an etch-stop and barrier layer for copper d...

Method of application of displacement reaction to form a conductive...

Method of application of copper solution in flip-chip, COB, and mic...

Low dielectric constant dielectric layer fabrication method employi...

Method to thin down copper barriers in deep submicron geometries by...

Method of application of conductive cap-layer in flip-chip, COB, an...

Patents Applicationslast 30 patents

OPTOELECTRONIC MODULES INCLUDING OPTOELECTRONIC DEVICE SUBASSEMBLIE...

OPTOELECTRONIC MODULES THAT HAVE SHIELDING TO REDUCE LIGHT LEAKAGE...

OPTOELECTRONIC MODULES INCLUDING OPTOELECTRONIC DEVICE SUBASSEMBLIE...

OPTOELECTRONIC MODULES THAT HAVE SHIELDING TO REDUCE LIGHT LEAKAGE...

OPTOELECTRONIC MODULES THAT HAVE SHIELDING TO REDUCE LIGHT LEAKAGE...

OPTOELECTRONIC MODULES THAT HAVE SHIELDING TO REDUCE LIGHT LEAKAGE...

OPTOELECTRONIC MODULES THAT HAVE SHIELDING TO REDUCE LIGHT LEAKAGE...

Method and Apparatus for an Algorithm Development Environment for S...

Method of copper/copper surface bonding using a conducting polymer...

Method of copper/copper surface bonding using a conducting polymer...

Method of copper/copper surface bonding using a conducting polymer...

Method to create a copper diffusion deterrent interface

Method, system and mobile host for mobility pattern based selection...

Method of using hydrogen plasma to pre-clean copper surfaces during...

Apparatus and methods to clean copper contamination on wafer edge

Method of using silicon rich carbide as a barrier material for fluo...

Method of application of conductive cap-layer in flip-chip, cob, an...

Method for cleaning semiconductor structures using hydrocarbon and...

Use of boron carbide as an etch-stop and barrier layer for copper d...

Application of vapor phase HFACAC-based compound for use in copper...

Gap filling process in integrated circuits using low dielectric con...