Yi Yan

Person

Milpitas, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing an integrated transformer with printed cor...
- Patent number 11,887,776
- Issue date Jan 30, 2024
- Texas Instruments Incorporated
- Yi Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated power converter package with molded transformer
- Patent number 11,870,341
- Issue date Jan 9, 2024
- Texas Instruments Incorporated
- Yi Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing transformers with laminate windings and bui...
- Patent number 11,869,855
- Issue date Jan 9, 2024
- Texas Instruments Incorporated
- Zhemin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transformers with build-up films
- Patent number 11,488,914
- Issue date Nov 1, 2022
- Texas Instruments Incorporated
- Zhemin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out electronic device
- Patent number 11,410,875
- Issue date Aug 9, 2022
- Texas Instruments Incorporated
- Hau Thanh Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with enhanced heat dissipation
- Patent number 11,404,360
- Issue date Aug 2, 2022
- Texas Instruments Incorporated
- Zhemin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit backside metallization
- Patent number 11,367,699
- Issue date Jun 21, 2022
- Texas Instruments Incorporated
- Hiroyuki Sada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit backside metallization
- Patent number 10,763,230
- Issue date Sep 1, 2020
- Texas Instruments Incorporated
- Hiroyuki Sada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive deposition low temperature curable magnetic interconnectin...
- Patent number 10,650,957
- Issue date May 12, 2020
- Texas Instruments Incorporated
- Yi Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed repassivation for wafer chip scale packaging
- Patent number 10,541,220
- Issue date Jan 21, 2020
- Texas Instruments Incorporated
- Daiki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED STACKED SUBSTRATE FOR ISOLATED POWER MODULE
- Publication number 20250096084
- Publication date Mar 20, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Vijaylaxmi Khanolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH FLAT COPPER WINDING
- Publication number 20240347267
- Publication date Oct 17, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yi YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED TRANSFORMER WITH PRINTED CORE PIECE
- Publication number 20240170207
- Publication date May 23, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yi Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MAGNETIC COMPOUND MOLDED INTEGRATED ISOLATION TRANSFORMER
- Publication number 20240038429
- Publication date Feb 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yi Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH INDUCTOR IN MAGNETIC PACKAGE
- Publication number 20240006259
- Publication date Jan 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Hidetoshi Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED POWER CONVERTER PACKAGE WITH MOLDED TRANSFORMER
- Publication number 20230268826
- Publication date Aug 24, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yi Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFORMERS WITH BUILD-UP FILMS
- Publication number 20230018894
- Publication date Jan 19, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Zhemin ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MAGNETIC CORE AND WINDING LAMINA
- Publication number 20220310302
- Publication date Sep 29, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Yi Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH ENHANCED HEAT DISSIPATION
- Publication number 20220208662
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Zhemin ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFORMERS WITH SEPARATED MAGNETIC MEMBERS
- Publication number 20220068556
- Publication date Mar 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Yi YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED TRANSFORMER WITH PRINTED CORE PIECE
- Publication number 20210398736
- Publication date Dec 23, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Yi Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFORMERS WITH BUILD-UP FILMS
- Publication number 20210091016
- Publication date Mar 25, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Zhemin ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT BACKSIDE METALLIZATION
- Publication number 20210035932
- Publication date Feb 4, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Hiroyuki SADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPASSIVATION APPLICATION FOR WAFER-LEVEL CHIP-SCALE PACKAGE
- Publication number 20200388508
- Publication date Dec 10, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
FAN-OUT ELECTRONIC DEVICE
- Publication number 20200203219
- Publication date Jun 25, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Hau Thanh Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT BACKSIDE METALLIZATION
- Publication number 20200203295
- Publication date Jun 25, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Hiroyuki SADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVE DEPOSITION LOW TEMPERATURE CURABLE MAGNETIC INTERCONNECTIN...
- Publication number 20200135381
- Publication date Apr 30, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Yi YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INKJET PRINTED ELECTRONIC COMPONENTS
- Publication number 20200105453
- Publication date Apr 2, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Yi YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED REPASSIVATION FOR WAFER CHIP SCALE PACKAGING
- Publication number 20200043878
- Publication date Feb 6, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Daiki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Method for manufacturing an integrated transformer with printed cor...

Isolated power converter package with molded transformer

Method of manufacturing transformers with laminate windings and bui...

Transformers with build-up films

Fan-out electronic device

Power module with enhanced heat dissipation

Integrated circuit backside metallization

Integrated circuit backside metallization

Additive deposition low temperature curable magnetic interconnectin...

Printed repassivation for wafer chip scale packaging

Patents Applicationslast 30 patents

INTEGRATED STACKED SUBSTRATE FOR ISOLATED POWER MODULE

POWER MODULE WITH FLAT COPPER WINDING

INTEGRATED TRANSFORMER WITH PRINTED CORE PIECE

STACKED MAGNETIC COMPOUND MOLDED INTEGRATED ISOLATION TRANSFORMER

INTEGRATED CIRCUIT WITH INDUCTOR IN MAGNETIC PACKAGE

ISOLATED POWER CONVERTER PACKAGE WITH MOLDED TRANSFORMER

TRANSFORMERS WITH BUILD-UP FILMS

INTEGRATED MAGNETIC CORE AND WINDING LAMINA

POWER MODULE WITH ENHANCED HEAT DISSIPATION

TRANSFORMERS WITH SEPARATED MAGNETIC MEMBERS

INTEGRATED TRANSFORMER WITH PRINTED CORE PIECE

TRANSFORMERS WITH BUILD-UP FILMS

INTEGRATED CIRCUIT BACKSIDE METALLIZATION

REPASSIVATION APPLICATION FOR WAFER-LEVEL CHIP-SCALE PACKAGE

FAN-OUT ELECTRONIC DEVICE

INTEGRATED CIRCUIT BACKSIDE METALLIZATION

ADDITIVE DEPOSITION LOW TEMPERATURE CURABLE MAGNETIC INTERCONNECTIN...

INKJET PRINTED ELECTRONIC COMPONENTS

PRINTED REPASSIVATION FOR WAFER CHIP SCALE PACKAGING