Yi-Yang Lei

Person

Wuqi Township, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure and manufacturing method of package structure the...
- Patent number 12,051,666
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chuck, lamination process, and manufacturing method of semiconducto...
- Patent number 11,993,066
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Jie Huang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Polishing pad, polishing apparatus and method of manufacturing semi...
- Patent number 11,878,388
- Issue date Jan 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Cheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process including a re-etching process for forming a semiconductor...
- Patent number 11,742,317
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 11,587,902
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,569,183
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Yu Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method of package structure the...
- Patent number 11,355,466
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including dies having high-modulus dielectric...
- Patent number 11,270,921
- Issue date Mar 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 11,069,652
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Alexander Kalnitsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 10,867,939
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Yu Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and packaged...
- Patent number 10,790,252
- Issue date Sep 29, 2020
- Taiwan Semiconductor Manufacturing Company
- Yi-Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 10,535,629
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Alexander Kalnitsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 10,522,501
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and packaged...
- Patent number 10,269,747
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company
- Yi-Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 10,163,849
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Alexander Kalnitsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 9,799,625
- Issue date Oct 24, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Alexander Kalnitsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning residual molding compound on solder bumps
- Patent number 8,748,306
- Issue date Jun 10, 2014
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
UBM etching methods for eliminating undercut
- Patent number 8,501,613
- Issue date Aug 6, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing UBM undercut in metal bump structures
- Patent number 8,389,397
- Issue date Mar 5, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor die
- Patent number 8,258,055
- Issue date Sep 4, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE AND PACKAGE STRUCTURE THE...
- Publication number 20240339427
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATION PROCESS, AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKA...
- Publication number 20240198651
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jie Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240186308
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTERCONNECT STRUCTURES
- Publication number 20240113032
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE CHUCK, WORKPIECE HANDLING APPARATUS, MANUFACTURING METHOD...
- Publication number 20240063048
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Ching Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATION PROCESS, AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKA...
- Publication number 20240017538
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jie Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process Including a Re-etching Process for Forming a Semiconductor...
- Publication number 20230352442
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company Co., Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230307404
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Yu Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20230115449
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Yu Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHUCK, LAMINATION PROCESS, AND MANUFACTURING METHOD OF SEMICONDUCTO...
- Publication number 20220314595
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jie Huang
- B32 - LAYERED PRODUCTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE THE...
- Publication number 20220262758
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210242100
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE THE...
- Publication number 20210242159
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20210098395
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Yu Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20200168568
- Publication date May 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Yu Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20200152599
- Publication date May 14, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- ALEXANDER KALNITSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure and Method of Forming the Same
- Publication number 20200051949
- Publication date Feb 13, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure and Method of Forming the Same
- Publication number 20200013750
- Publication date Jan 9, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING PAD, POLISHING APPARATUS AND METHOD OF MANUFACTURING SEMI...
- Publication number 20190381630
- Publication date Dec 19, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Cheng Wang
- B24 - GRINDING POLISHING
Information Patent Application
Three-step Etching to Form RDL
- Publication number 20190157240
- Publication date May 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20190115313
- Publication date Apr 18, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- ALEXANDER KALNITSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices, Methods of Manufacture Thereof, and Packaged...
- Publication number 20180337155
- Publication date Nov 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20180047701
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- ALEXANDER KALNITSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20160365332
- Publication date Dec 15, 2016
- Taiwan Semiconductor Manufacturing company Ltd.
- ALEXANDER KALNITSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices, Methods of Manufacture Thereof, and Packaged...
- Publication number 20140117533
- Publication date May 1, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING RESIDUAL MOLDING COMPOUND ON SOLDER BUMPS
- Publication number 20130034956
- Publication date Feb 7, 2013
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Yang LEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UBM Etching Methods for Eliminating Undercut
- Publication number 20130012014
- Publication date Jan 10, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Reducing UBM Undercut in Metal Bump Structures
- Publication number 20120064712
- Publication date Mar 15, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BUMP FOR SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURE
- Publication number 20120007230
- Publication date Jan 12, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS

Yi-Yang Lei

Person

Patents Grantslast 30 patents

Package structure and manufacturing method of package structure the...

Chuck, lamination process, and manufacturing method of semiconducto...

Polishing pad, polishing apparatus and method of manufacturing semi...

Process including a re-etching process for forming a semiconductor...

Semiconductor structure and method of forming the same

Package structure and method of fabricating the same

Package structure and manufacturing method of package structure the...

Semiconductor package including dies having high-modulus dielectric...

Method of manufacturing semiconductor structure

Package structure and method of fabricating the same

Semiconductor devices, methods of manufacture thereof, and packaged...

Method of manufacturing semiconductor structure

Semiconductor structure and method of forming the same

Semiconductor devices, methods of manufacture thereof, and packaged...

Method of manufacturing semiconductor structure

Semiconductor structure and manufacturing method thereof

Cleaning residual molding compound on solder bumps

UBM etching methods for eliminating undercut

Method for reducing UBM undercut in metal bump structures

Method of forming semiconductor die

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF PACKAGE STRUCTURE AND PACKAGE STRUCTURE THE...

LAMINATION PROCESS, AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKA...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGED INTERCONNECT STRUCTURES

WORKPIECE CHUCK, WORKPIECE HANDLING APPARATUS, MANUFACTURING METHOD...

LAMINATION PROCESS, AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKA...

Process Including a Re-etching Process for Forming a Semiconductor...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

CHUCK, LAMINATION PROCESS, AND MANUFACTURING METHOD OF SEMICONDUCTO...

PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE THE...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE THE...

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

Semiconductor Structure and Method of Forming the Same

Semiconductor Structure and Method of Forming the Same

POLISHING PAD, POLISHING APPARATUS AND METHOD OF MANUFACTURING SEMI...

Three-step Etching to Form RDL

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

Semiconductor Devices, Methods of Manufacture Thereof, and Packaged...

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor Devices, Methods of Manufacture Thereof, and Packaged...

CLEANING RESIDUAL MOLDING COMPOUND ON SOLDER BUMPS

UBM Etching Methods for Eliminating Undercut

Method for Reducing UBM Undercut in Metal Bump Structures

CONDUCTIVE BUMP FOR SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURE