Yian-Liang Kuo

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnect structures, packaged semiconductor devices, and method...
- Patent number 12,159,862
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure for enhanced bondability
- Patent number 11,996,368
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ru-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of analyzing semiconductor structure
- Patent number 11,959,958
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi Min Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having thermal dissipation structure therein and...
- Patent number 11,935,760
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure for enhanced bondability
- Patent number 11,728,279
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ru-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure for enhanced bondability
- Patent number 11,227,836
- Issue date Jan 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ru-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of analyzing semiconductor structure
- Patent number 10,955,459
- Issue date Mar 23, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi Min Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures, packaged semiconductor devices, and method...
- Patent number 10,867,975
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods for forming the same
- Patent number 10,770,366
- Issue date Sep 8, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods for forming the same
- Patent number 10,510,635
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structures of integrated circuits
- Patent number 10,453,818
- Issue date Oct 22, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures, packaged semiconductor devices, and method...
- Patent number 10,340,258
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus of packaging semiconductor devices
- Patent number 10,269,750
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods for forming the same
- Patent number 10,056,312
- Issue date Aug 21, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods for forming the same
- Patent number 9,780,009
- Issue date Oct 3, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus of packaging semiconductor devices
- Patent number 9,659,890
- Issue date May 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protecting flip-chip package using pre-applied fillet
- Patent number 9,620,414
- Issue date Apr 11, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods for forming the same
- Patent number 9,196,532
- Issue date Nov 24, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus of packaging semiconductor devices
- Patent number 9,136,235
- Issue date Sep 15, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protecting flip-chip package using pre-applied fillet
- Patent number 9,064,881
- Issue date Jun 23, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having under-bump metallization (UBM) structur...
- Patent number 9,059,158
- Issue date Jun 16, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad design for improved routing and reduced package stress
- Patent number 9,053,943
- Issue date Jun 9, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Mang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging devices, methods of manufacture thereof, and packaging me...
- Patent number 8,994,155
- Issue date Mar 31, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-passivation interconnect structure and methods for forming the...
- Patent number 8,846,548
- Issue date Sep 30, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having under-bump metallization (UBM) structur...
- Patent number 8,803,338
- Issue date Aug 12, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under-bump metallization (UBM) structure and method of forming the...
- Patent number 8,581,420
- Issue date Nov 12, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protecting sidewalls of semiconductor chips using insulation films
- Patent number 8,580,657
- Issue date Nov 12, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yian-Liang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bump structure
- Patent number 8,581,399
- Issue date Nov 12, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus of under bump metallization in packaging semi...
- Patent number 8,569,886
- Issue date Oct 29, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protecting T-contacts of chip scale packages from moisture
- Patent number 8,507,316
- Issue date Aug 13, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Chen Chu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT STRUCTURES, PACKAGED SEMICONDUCTOR DEVICES, AND METHOD...
- Publication number 20240395782
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING THERMAL DISSIPATION STRUCTURE THEREIN AND...
- Publication number 20240258122
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ANALYZING SEMICONDUCTOR STRUCTURE
- Publication number 20240192262
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- Yi Min LIU
- G01 - MEASURING TESTING
Information Patent Application
BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING...
- Publication number 20240096825
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD STRUCTURE FOR ENHANCED BONDABILITY
- Publication number 20230343719
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ru-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230068578
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD STRUCTURE FOR ENHANCED BONDABILITY
- Publication number 20220139838
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ru-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ANALYZING SEMICONDUCTOR STRUCTURE
- Publication number 20210172995
- Publication date Jun 10, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- Yi Min LIU
- G01 - MEASURING TESTING
Information Patent Application
Interconnect Structures, Packaged Semiconductor Devices, and Method...
- Publication number 20210098435
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd. Hsinchu
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD STRUCTURE FOR ENHANCED BONDABILITY
- Publication number 20200126920
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Ru-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods for Forming the Same
- Publication number 20200091027
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ANALYZING SEMICONDUCTOR STRUCTURE
- Publication number 20200003825
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- Yi Min LIU
- G01 - MEASURING TESTING
Information Patent Application
Interconnect Structures, Packaged Semiconductor Devices, and Method...
- Publication number 20190273071
- Publication date Sep 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods for Forming the Same
- Publication number 20180308778
- Publication date Oct 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Structures of Integrated Circuits
- Publication number 20180151528
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods for Forming the Same
- Publication number 20180025959
- Publication date Jan 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus of Packaging Semiconductor Devices
- Publication number 20170256512
- Publication date Sep 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures, Packaged Semiconductor Devices, and Method...
- Publication number 20160322336
- Publication date Nov 3, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods for Forming the Same
- Publication number 20160086867
- Publication date Mar 24, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus of Packaging Semiconductor Devices
- Publication number 20160005704
- Publication date Jan 7, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protecting Flip-Chip Package using Pre-Applied Fillet
- Publication number 20150287640
- Publication date Oct 8, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTUR...
- Publication number 20140327136
- Publication date Nov 6, 2014
- Tsung-Fu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Post-Passivation Interconnect Structure and Methods for Forming the...
- Publication number 20140191392
- Publication date Jul 10, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Devices, Methods of Manufacture Thereof, and Packaging Me...
- Publication number 20140110836
- Publication date Apr 24, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus of Packaging Semiconductor Devices
- Publication number 20140057431
- Publication date Feb 27, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTUR...
- Publication number 20140042619
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods for Forming the Same
- Publication number 20130341800
- Publication date Dec 26, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus of Packaging Semiconductor Devices
- Publication number 20130127052
- Publication date May 23, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Structures of Integrated Circuits
- Publication number 20130087925
- Publication date Apr 11, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BUMP STRUCTURE
- Publication number 20130026621
- Publication date Jan 31, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu TSAI
- H01 - BASIC ELECTRIC ELEMENTS

Yian-Liang Kuo

Person

Patents Grantslast 30 patents

Interconnect structures, packaged semiconductor devices, and method...

Pad structure for enhanced bondability

Method of analyzing semiconductor structure

Package structure having thermal dissipation structure therein and...

Pad structure for enhanced bondability

Pad structure for enhanced bondability

Method of analyzing semiconductor structure

Interconnect structures, packaged semiconductor devices, and method...

Integrated circuit packages and methods for forming the same

Integrated circuit packages and methods for forming the same

Packaging structures of integrated circuits

Interconnect structures, packaged semiconductor devices, and method...

Methods and apparatus of packaging semiconductor devices

Integrated circuit packages and methods for forming the same

Integrated circuit packages and methods for forming the same

Methods and apparatus of packaging semiconductor devices

Protecting flip-chip package using pre-applied fillet

Integrated circuit packages and methods for forming the same

Methods and apparatus of packaging semiconductor devices

Protecting flip-chip package using pre-applied fillet

Semiconductor device having under-bump metallization (UBM) structur...

Bond pad design for improved routing and reduced package stress

Packaging devices, methods of manufacture thereof, and packaging me...

Post-passivation interconnect structure and methods for forming the...

Semiconductor device having under-bump metallization (UBM) structur...

Under-bump metallization (UBM) structure and method of forming the...

Protecting sidewalls of semiconductor chips using insulation films

Metal bump structure

Methods and apparatus of under bump metallization in packaging semi...

Protecting T-contacts of chip scale packages from moisture

Patents Applicationslast 30 patents

INTERCONNECT STRUCTURES, PACKAGED SEMICONDUCTOR DEVICES, AND METHOD...

PACKAGE STRUCTURE HAVING THERMAL DISSIPATION STRUCTURE THEREIN AND...

METHOD OF ANALYZING SEMICONDUCTOR STRUCTURE

BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING...

PAD STRUCTURE FOR ENHANCED BONDABILITY

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PAD STRUCTURE FOR ENHANCED BONDABILITY

METHOD OF ANALYZING SEMICONDUCTOR STRUCTURE

Interconnect Structures, Packaged Semiconductor Devices, and Method...

PAD STRUCTURE FOR ENHANCED BONDABILITY

Integrated Circuit Packages and Methods for Forming the Same

METHOD OF ANALYZING SEMICONDUCTOR STRUCTURE

Interconnect Structures, Packaged Semiconductor Devices, and Method...

Integrated Circuit Packages and Methods for Forming the Same

Packaging Structures of Integrated Circuits

Integrated Circuit Packages and Methods for Forming the Same

Methods and Apparatus of Packaging Semiconductor Devices

Interconnect Structures, Packaged Semiconductor Devices, and Method...

Integrated Circuit Packages and Methods for Forming the Same

Methods and Apparatus of Packaging Semiconductor Devices

Protecting Flip-Chip Package using Pre-Applied Fillet

SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTUR...

Post-Passivation Interconnect Structure and Methods for Forming the...

Packaging Devices, Methods of Manufacture Thereof, and Packaging Me...

Methods and Apparatus of Packaging Semiconductor Devices

SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTUR...

Integrated Circuit Packages and Methods for Forming the Same

Methods and Apparatus of Packaging Semiconductor Devices

Packaging Structures of Integrated Circuits

METAL BUMP STRUCTURE