Membership
Tour
Register
Log in
Yibo LIU
Follow
Person
Wuxi, CN
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Method of manufacturing fan out wafer level package
Patent number
9,773,684
Issue date
Sep 26, 2017
National Center for Advanced Packaging Co., Ltd.
Hongjie Wang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD OF MANUFACTURING FAN OUT WAFER LEVEL PACKAGE
Publication number
20160218020
Publication date
Jul 28, 2016
National Center for Advanced Packaging Co., Ltd.
Hongjie WANG
H01 - BASIC ELECTRIC ELEMENTS